Silicon Photonics– tag –
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Semiconductor Back-End
Semiconductor Engineering June 2026 Report Highlights On-Chip Photonics, Hybrid Bonding, and GaN for AI/HPC
Semiconductor Engineering USA Overview Semiconductor Engineering's June 2026 issue features on-chip photonics for AI systems, enhanced connectivity via hybrid bonding, new GaN power device designs, and managing manufacturing variations a... -
Photonics
TechInsights Identifies Silicon Photonics as Backbone for HPC and AI Data Centers, Highlighting New Industry Opportunities
TechInsights Blog Canada Overview TechInsights' analysis highlights silicon photonics as an indispensable backbone rapidly emerging for High-Performance Computing (HPC) and AI data centers. This technology overcomes the limitations of tr... -
Photonics
Tower Semiconductor and Marvell Exceed 5 Million Coherent PIC Shipments for AI Data Centers, Driving High-Performance Connectivity
PIC Magazine USA Overview Tower Semiconductor and Marvell have announced shipping over 5 million coherent Photonic Integrated Circuits (PICs) for AI data centers. This milestone underscores their success in delivering high-speed, low-pow... -
Photonics
Data Gravity Analysis: AI Interconnects Shift from Copper to Optical, with NVIDIA Leading with CPO-Equipped Spectrum-X Switches
Data Gravity USA Overview Data Gravity's analysis indicates that frontier AI performance constraints are shifting from accelerator supply to interconnects, highlighting challenges in chip-to-chip, GPU-to-GPU, and rack-to-rack connectivit... -
Photonics
NVIDIA Commits $4.5 Billion Investment in Optical Supply Chain for AI Data Centers, Anticipating 35% CPO Adoption by 2030
BingX Singapore Overview NVIDIA has invested $4 billion in Lumentum and Coherent, plus $500 million in Corning, to secure next-generation silicon photonics laser supply and expand optical connectivity manufacturing capacity. This strateg... -
Semiconductor Back-End
Credo Completes DustPhotonics Acquisition, Bolstering Co-Packaged Optics (CPO) Solutions to Accelerate AI Data Centers
Advanced Packaging News USA Overview Credo has completed its acquisition of DustPhotonics, significantly strengthening its Co-Packaged Optics (CPO) solutions. This acquisition is poised to advance high-bandwidth, low-power interconnect t... -
Semiconductor Back-End
ASMPT Establishes Advanced Packaging Technology Advisory Council to Accelerate AI-Era Innovation
ASMPT Singapore Overview ASMPT has established an Advanced Packaging Technology Advisory Council (TAC) to address the growing importance of advanced packaging for next-generation computing and AI components. The TAC will focus on a broad... -
Photonics
Photonics Spectra: Optical Technology to Transform Surroundings into “Virtual Screens,” Significantly Boosting 3D Machine Vision for Robotics and AR/VR
Photonics Spectra USA Overview New advancements in light-based technology are expected to dramatically enhance 3D machine vision by enabling physical surroundings to be transformed into "virtual screens." This could improve environmental... -
Photonics
Nokia’s Optical Network Business Set for 31% Surge to €4 Billion by 2026, Fueled by NVIDIA’s $1B Investment and Hyperscaler AI Demand
S&P Global フィンランド Overview Nokia's optical network infrastructure revenue is projected to surge 31% year-over-year, reaching €4 billion by 2026, primarily driven by a strategic $1 billion investment from NVIDIA and escalating hyper... -
Photonics
Marvell Acquires Celestial AI for $3 Billion to Secure CPO Core Technology, Expands Silicon Photonics Collaboration with NVIDIA
Global Semi Research USA Overview Marvell has strategically transformed into a key player in AI data center interconnect and custom chips by acquiring Celestial AI for approximately $3 billion in December 2025, gaining crucial Co-Package...