Silicon Photonics– tag –
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Lumentum CEO Flags Indium Phosphide Wafer Shortage; US Regulators Consider Banning Chinese Optical Transceivers, Potentially Benefiting Coherent and Other US Firms
Morningstar USA Overview Lumentum Holdings' CEO has warned that indium phosphide wafers, crucial for silicon photonics, could face a more severe supply crunch than memory semiconductors. Proactively, Lumentum has deposited $87 million wi... -
Thin-Film Lithium Niobate Modulators Emerge as Core Technology for Next-Gen Photonic Systems, Delivering Ultra-High Bandwidth and Low Power Consumption
Liobate International Overview Thin-film Lithium Niobate (TFLN) modulators are establishing themselves as a critical component for next-generation high-speed and high-efficiency photonic systems, addressing the escalating demand for fast... -
Ayar Labs’ UCIe-Compatible ‘TeraPHY’ Optical I/O Engine Extends AI Scale-Up Beyond the Rack, Strengthening Ecosystem Partnerships
TechArena Forum USA Overview Ayar Labs announced its "TeraPHY" optical I/O engine, built on silicon photonics and standard CMOS, connects via a UCIe-based electrical interface to enable AI scale-up beyond single-rack constraints. The com... -
Marvell Technology Enters S&P 500, Stock Triples in 2026 as Data Center Business Drives 76% of Revenue, Led by AI Optical Modules and 51.2T Ethernet Switches
Investing.com AU Australia Overview Marvell Technology has been added to the S&P 500 index, with its stock nearly tripling in 2026, demonstrating rapid growth fueled by AI infrastructure investments. The company reported that 76% of ... -
Major Foundries Advance CPO Roadmaps as NVIDIA Spectrum-X and Broadcom Taurus BCM83640 Enter Mass Production and 400G/Lane DSP Era
Tom's Hardware USA Overview Leading foundries (TSMC, Intel, Samsung, GlobalFoundries) are aggressively pursuing Co-Packaged Optics (CPO) roadmaps to address scale-up connectivity bottlenecks in AI clusters. NVIDIA has initiated mass prod... -
ASMPT’s Advanced Packaging Business Achieves Record Sales in H1 2026, Driven by Surging AI Demand
ASMPT Singapore Overview ASMPT reported robust financial results for the first half of 2026, with its Advanced Packaging (AP) business achieving record sales, significantly propelled by escalating AI demand. Key contributors included The... -
NVIDIA and Broadcom Commence Mass Production of Co-Packaged Optics (CPO) Switches: Poised to Cut Data Center Power Consumption by Up to 3.5x
Electronics360 USA Overview NVIDIA and Broadcom have initiated mass production of Co-Packaged Optics (CPO) switches, designed to significantly reduce data center power consumption and latency. NVIDIA's Spectrum-X CPO switch, co-developed... -
Micro-Transfer Printing Unlocks Scalable Heterogeneous Integration for Next-Gen Silicon Photonics: A Ghent University and imec Breakthrough
Photonics Online Belgium Overview Researchers from Ghent University and imec have validated micro-transfer printing (MTP) as a highly promising technique for heterogeneous integration in silicon photonics. MTP effectively merges precisio... -
Leading Foundries Accelerate Silicon Photonics Mass Production for AI/HPC Demand: UMC Ships First 12-inch Wafers, TSMC’s COUPE Enters Production
TrendForce Taiwan Overview Major foundries including TSMC, UMC, GlobalFoundries, and Tower Semiconductor are accelerating their silicon photonics efforts to meet the growing demand for data transmission bandwidth driven by increasing AI ... -
GlobalFoundries Secures $300M U.S. Department of Commerce Award to Accelerate Silicon Photonics R&D, Bolstering U.S. Leadership
GlobalFoundries USA Overview GlobalFoundries has signed a Letter of Intent with the U.S. Department of Commerce for a $300 million award from the CHIPS R&D Office. This funding aims to accelerate next-generation silicon photonics R&a...
