Silicon Photonics– tag –
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TSMC Unveils Next-Gen ‘COUPE’ Silicon Photonics Platform for AI Optical Interconnect, Targeting 1.6 Tb/s Optical Engines by 2026
Tech Investments Taiwan Overview TSMC has announced 'COUPE,' a silicon photonics platform for co-packaged optics (CPO) in the AI era. COUPE innovatively stacks two dies—a photonic IC and an electronic IC—using SoIC bonding, placing the o... -
STMicroelectronics Launches 300mm Wafer Production of PIC100 Silicon Photonics for AI Data Centers
EE Times International Overview STMicroelectronics has begun mass production of its PIC100 silicon photonics platform on 300mm wafers to meet the escalating demands of AI data centers. This platform integrates BiCMOS for laser drivers wi... -
Tower Semiconductor Invests $3 Billion in Japan with METI Support, Reviving Fab for 300mm Silicon Photonics Manufacturing
Tom's Hardware Japan Overview Tower Semiconductor has announced a $3 billion investment, backed by Japan's Ministry of Economy, Trade and Industry (METI), to expand its semiconductor operations in Japan, focusing on 300mm silicon photoni... -
MIT Develops Novel Solid-State LiDAR Chip with Wider Field of View, Potentially Revolutionizing Autonomous Vehicles
ScienceDaily USA Overview MIT researchers have developed a new silicon photonics LiDAR chip that provides a wider and clearer field of view without any moving parts. This innovative design achieves minimal crosstalk by closely integratin... -
SILITH Technology Receives First Mass-Produced Silicon Photonics Wafers from UMC’s Singapore 12-inch Fab
Semiconductor Today Singapore Overview SILITH Technology, a Singaporean fabless silicon photonics company, has received its first mass-produced photonic IC wafers from UMC's 12-inch fab in Singapore. This collaboration aims to scale up n... -
Nvidia and Broadcom Adopt CPO/Silicon Photonics for Volume Production, Bringing Profit Waves to Supply Chain
BigGo Finance USA Overview Nvidia and Broadcom have initiated full adoption of Co-Packaged Optics (CPO) and silicon photonics technologies, moving their respective ecosystems into the volume shipment phase. This strategic shift aims to m... -
Silicon Photonics Emerges as Key for AI Data Centers, Driving 800G/1.6T Transceivers and CPO Integration to Overcome Electrical Limits
MarketWise USA Overview As AI infrastructure approaches the limits of electrical interconnects, silicon photonics is rapidly becoming the essential technology for achieving high bandwidth and efficiency in data centers. The commercial de... -
Samsung Electronics Advances “2.xD” Packaging Integrating HBM, Logic, and Optical Tech to Resolve AI Power and Heat Bottlenecks
BigGo Finance South Korea Overview Samsung Electronics is developing "2.xD" next-generation packaging technology that integrates High Bandwidth Memory (HBM), logic chips, and silicon photonics (SiPh) into a single package to address crit... -
TSMC Leads in Data Center Co-Packaged Optics, While Samsung Pursues Future AI Packaging with HBM, Logic, and SiPh Integration in ‘2.xD’ Technology
KuCoin International Overview TSMC leads the data center co-packaged optics (CPO) switch market, with Broadcom and NVIDIA already sampling or shipping CPO switches based on TSMC's technology. Concurrently, Samsung is developing '2.xD' ad... -
Samsung Develops ‘2.xD’ Advanced Packaging Integrating HBM, Logic, and SiPh to Tackle AI Data Center Power and Data Bottlenecks
DigiTimes Taiwan Overview Samsung Electronics is developing '2.xD' advanced packaging technology that integrates HBM, logic chips, and silicon photonics (SiPh) into a single package. This innovation aims to resolve critical power consump...
