System-in-Package– tag –
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STMicroelectronics Unveils Modular SiP Solution for Automotive AI Market, Driving Miniaturization and Performance in Autonomous Driving and ADAS
Electronics Weekly Switzerland/France Overview STMicroelectronics has launched a new modular System-in-Package (SiP) solution specifically designed for automotive AI applications. This solution integrates multiple chips to reduce footpri... -
Amkor to Invest $7 Billion in Arizona for Advanced AI Chip Packaging, Shifts Korean SiP Production to Vietnam
Seeking Alpha USA Overview Amkor Technology is making a monumental $7 billion investment to construct an advanced packaging and test campus in Arizona, slated for production by early 2028, to address the escalating demand for AI chips. T... -
Micro-CT Emerges as Key Non-Destructive 3D Analysis Approach for Semiconductor Package Warpage, Addressing Critical Reliability Challenges
AZoM UK Overview Semiconductor package warpage is a critical issue significantly compromising package performance and reliability. This deformation stems from Coefficient of Thermal Expansion mismatches among package materials (substrate... -
TSMC Accelerates Backend Ecosystem Reorganization, Reshaping Semiconductor Competitive Landscape as Advanced Packaging Breaks Process Shrinkage Limits
The Economy Taiwan Overview Advanced packaging technology is rapidly emerging as a new competitive domain in the semiconductor industry, gaining importance as traditional process shrinkage approaches its technical limits. Packaging techn... -
Sumitomo Bakelite Realigns 2026 CapEx to Asian Fabrication Nodes as 35.7% Operating Profit Expansion Signals Structural De-commoditization in Semiconductor Encapsulation Materials
HDIN Research Japan Overview Sumitomo Bakelite has announced a strategic realignment of its 2026 capital expenditures, focusing on semiconductor encapsulation material manufacturing sites in Asia. The company reported a significant 35.7%... -
Henkel Offers Liquid Compression Molding (LCM) Solutions for Wafer-Level and Panel-Level Packaging
Henkel Adhesives Germany Overview Henkel provides encapsulation materials that enable advanced semiconductor packaging technologies where ICs are molded directly on wafers or panels prior to subsequent processing, using Liquid Compressio... -
Amkor Technology Shifts SiP Production to Vietnam to Enhance High-Value Programs, Driven by Strong Demand for Advanced Packaging in Premium Smartphones
TradingView USA Overview Amkor Technology continues to benefit from robust demand for advanced packaging solutions like flip-chip and System-in-Package (SiP), fueled by increased semiconductor content in premium smartphones. The company ... -
Low-Stress Mold Compounds Evolve to Protect Fragile Components in Advanced Semiconductor Packages
Global Semiconductor Global Overview Modern low-stress molding technologies encompass diverse material compositions, including silicone-based compounds and modified epoxies with flexible segments. These compounds have evolved to address ...
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