Unimicron– tag –
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Market Trends
AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion
Tom's Hardware Japan Overview The supply shortage of ABF (Ajinomoto Build-up Film) substrates for AI accelerators is projected to worsen significantly, potentially reaching approximately 10% by late 2026, 21% by 2027, and over 40% by 202... -
Semiconductor Back-End
High-End ABF Substrate Supply Faces Critical Shortage Amid Gigantic AI Chip Growth, Fueling Intense Competition Among Taiwanese Manufacturers
Tom's Hardware Taiwan Overview The escalating computational power and physical size of AI chips have led to a severe global shortage in the supply of high-end Ajinomoto Build-up Film (ABF) substrates, a core component. In response, inten... -
Semiconductor Back-End
Unimicron Reports 90% Surge in Equipment Demand from AI, Japanese SME Dependence on ABF Substrates Creates Bottleneck
BigGo Finance Taiwan Overview Unimicron Technology Chairman Chien Shan-Chieh stated that escalating AI demand has severely impacted the substrate sector, worsening supply-demand imbalance due to heavy reliance on small and medium-sized J... -
Semiconductor Back-End
TSMC SVP Reports 90% Surge in Equipment Orders in Six Months Driven by AI Demand: Equivalent to Building 20 Fabs Globally Simultaneously
TechSoda Taiwan Overview TSMC Senior VP Cliff Hou reported an astonishing 90% surge in equipment orders over six months, driven by AI demand far exceeding forecasts, equivalent to constructing nearly 20 fabs worldwide simultaneously. Uni... -
Semiconductor Back-End
High-End ABF Substrate Shortage Intensifies Due to Massive AI Chips: Taiwanese Makers & Equipment Suppliers Face Fierce Competition
Medium (by Julien Nauy) International Overview The high-end ABF (Ajinomoto Build-up Film) substrate market for AI chips faces a severe supply shortage, reflecting a 're-evaluation of manufacturing difficulty' distinct from traditional AB... -
Semiconductor Back-End
Korean Tech Giants Accelerate AI Substrate Production Amid Soaring Demand, Nearing 90% Utilization
TrendForce Taiwan Overview The proliferation of AI data centers has created a critical shortage and driven up prices for advanced substrates essential for GPUs and HBM. In response, Samsung Electro-Mechanics (SEM) and LG Innotek are aggr... -
Semiconductor Back-End
Unimicron Initiates Mass Production at New Thai ABF Substrate Plant to Meet Surging AI Server Demand, Diversifying Geopolitical Risk
DigiTimes Japan Taiwan Overview Unimicron has commenced mass production at its new facility in Thailand, addressing the escalating demand for Ajinomoto Build-up Film (ABF) substrates, especially for AI servers. This strategic expansion a... -
Semiconductor Back-End
ABF Substrate Shortages Projected Through 2028 Amid AI Boom; Taiwanese, Japanese, Korean Manufacturers Secure Orders Until 2030
digitimes Taiwan Overview The global AI computing infrastructure boom is rapidly escalating demand for GPUs, CPUs, and ASICs, leading to projected ABF (Ajinomoto Build-up Film) substrate shortages starting in 2026 and worsening through 2... -
Semiconductor Back-End
AI Chip HBM Integration to Drive 29% ABF Substrate Shortage by 2028; $19.1B Expansion Unlikely to Offer Short-Term Relief
Unknown Taiwan Overview The rapid integration of High Bandwidth Memory (HBM) into AI chips is set to drive a 39% Compound Annual Growth Rate (CAGR) in ABF substrate demand between 2025 and 2028. This surge is projected to create a supply... -
Semiconductor Back-End
Advanced Package Substrate Market Heats Up: Ibiden Leads with $3.2 Billion Investment, Samsung Electro-Mechanics Challenges with Glass Substrates, Technical Hurdles Emerge
MK Japan Overview The package substrate market, crucial for AI semiconductor performance, is intensifying with major investments and technological competition. Japan's Ibiden maintains dominant leadership with ~35% market share, investin...
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