Unimicron– tag –
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AI-Driven Advanced Packaging Orders Surge, Widening ABF Carrier Board Supply-Demand Gap, Benefiting Industry with Both Volume and Price Increases
AlphaWire International Overview Nomura Securities reports the semiconductor packaging substrate industry is experiencing a strong AI-driven recovery, with global packaging substrate shipments up 36% year-on-year in June 2026. This growt... -
Wah Lee and Asahi Kasei Double Photoresist Capacity in Tainan to Capitalize on AI Advanced Packaging Boom and ABF Substrate Demand
BigGo Finance International Overview Wah Lee and Asahi Kasei are doubling high-resolution dry film photoresist capacity in Tainan to meet surging ABF substrate demand driven by AI, HPC, and advanced packaging. With the ABF substrate shor... -
ABF Substrates Emerge as the True Bottleneck in the AI Era, More Critical Than DRAM for High-Performance Computing
Industry Analysis International Overview ABF (Ajinomoto Build-up Film) substrates, not DRAM, are becoming the more critical bottleneck in the AI supply chain. Leading manufacturers like Ibiden and Unimicron are poised to benefit directly... -
Ibiden and Unimicron Unveil Over $5 Billion Investment to Dramatically Expand AI Server ABF Substrate Production
Next Financial Japan Overview Japanese Ibiden and Taiwanese Unimicron are jointly investing over ¥800 billion (approximately $5 billion USD) to significantly increase production capacity for high-performance ABF (Ajinomoto Build-up Film)...
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