Wafer-level– tag –
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Tower Semiconductor Invests $3 Billion in Japan with METI Support, Reviving Fab for 300mm Silicon Photonics Manufacturing
Tom's Hardware Japan Overview Tower Semiconductor has announced a $3 billion investment, backed by Japan's Ministry of Economy, Trade and Industry (METI), to expand its semiconductor operations in Japan, focusing on 300mm silicon photoni... -
SILITH Technology Receives First Mass-Produced Silicon Photonics Wafers from UMC’s Singapore 12-inch Fab
Semiconductor Today Singapore Overview SILITH Technology, a Singaporean fabless silicon photonics company, has received its first mass-produced photonic IC wafers from UMC's 12-inch fab in Singapore. This collaboration aims to scale up n... -
Silicon Photonics Emerges as Key for AI Data Centers, Driving 800G/1.6T Transceivers and CPO Integration to Overcome Electrical Limits
MarketWise USA Overview As AI infrastructure approaches the limits of electrical interconnects, silicon photonics is rapidly becoming the essential technology for achieving high bandwidth and efficiency in data centers. The commercial de... -
STMicroelectronics Ramps PIC100 Silicon Photonics Platform Production on 300mm Wafers to Meet AI Data Center Demand
EE Times Switzerland Overview STMicroelectronics is scaling up production of its PIC100 silicon photonics platform on 300mm wafers to address the escalating demand for high-capacity optical interconnects in AI data centers. This initiati... -
Aehr Test Systems Receives Follow-On Production Order from Lead Silicon Photonics Customer for FOX-XP Wafer-Level Burn-In System
Aehr Test Systems USA Overview Aehr Test Systems announced a follow-on production order for its fully automated FOX-XP Wafer-Level Burn-In (WLBI) system from a leading silicon photonics customer. This system is designed to support high-v... -
PLANOPTIK Provides Customized Glass Wafers and Panels for MEMS and Photonics Applications, Enhancing Wafer-Level Packaging
planoptik ag Germany Overview German company planoptik ag offers customized glass wafers and panels specifically for wafer-level packaging (WLP) in MEMS devices and photonic applications. These products are crucial for protecting, encaps... -
TrendForce Forecasts TSMC PIC Capacity to Soar to 25K Wafers/Month by 2028, with NVIDIA and Broadcom as Early COUPE Customers
TrendForce Taiwan Overview TrendForce projects TSMC's Photonic Integrated Circuit (PIC) wafer production capacity will surge to 25,000 wafers per month by 2028, a critical step for mass production of Co-Packaged Optics (CPO). NVIDIA and ... -
Coherent Invests $50M to Quadruple 6-inch InP Wafer Capacity, Addressing Surging 1.6T Optical Module Demand
Yole Group France Overview Coherent announced a $50 million investment to quadruple its 6-inch Indium Phosphide (InP) wafer production capacity. This strategic move aims to meet the explosive demand for 1.6T optical modules, driven by AI... -
AI Data Centers Face Persistent InP Component Shortage Despite Coherent and Semtech Capacity Boosts
Gaetano | Substack USA Overview The supply of Indium Phosphide (InP) components, critical for high-performance optical devices in AI data centers, remains constrained. While Coherent expands 6-inch InP wafer production and Semtech (via H... -
PhotonPath and XIVER Partner to Scale Oxyn Platform Manufacturing on 200mm Wafer Infrastructure
Optica Global Overview PhotonPath and XIVER have partnered to scale the manufacturing of PhotonPath's Oxyn platform, an integrated photonics platform for telecom and datacom applications. This collaboration transitions Oxyn manufacturing...
