Wafer-level– tag –
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AXT Inc. Announces Indium Phosphide (InP) Backlog Exceeds $100M and Plans to Double Manufacturing Capacity in Both 2026 and 2027
Facebook Taiwan Overview AXT Inc. (AXTI) has announced that its indium phosphide (InP) substrate backlog has surpassed $100 million, with robust long-term order visibility extending beyond 2027. To meet this strong demand, the company re... -
IMAPS Report Highlights Silicon Photonics, Co-Packaged Optics, and Advanced Packaging as Critical for Breaking AI Data Center Compute Barriers
IMAPS 3D InCites Content Platform USA Overview An IMAPS 3D InCites report emphasizes that optical interconnects are indispensable for addressing the massive demands placed on data centers by the rapid growth of large language models. A k... -
Atomica Unveils ‘AI Photonic Integration Platform’ to Overcome Integration Bottlenecks in AI Infrastructure
Chiplet Marketplace USA Overview Atomica has launched its 'AI Photonic Integration Platform' to address critical integration bottlenecks within AI infrastructure. This platform integrates advanced microfabrication technologies, including... -
China’s NOEIC Unveils Industry-First 170GHz TFLN Photonic Modulator; Domestic Firm Launches World’s First TFLN PIC Wafer, Accelerating Commercialization
LINIOBATE | Power Next Gen Photon China Overview China's National Optoelectronics Innovation Center (NOEIC) announced the industry's first 170GHz thin-film lithium niobate (TFLN) photonic modulator in June 2026, enabling single-lane 200G... -
Coherent to More Than Double 6-Inch InP Wafer Output by 2027 End Amid Accelerating 1.6T Transceiver Demand for AI Data Centers
The Motley Fool USA Overview Coherent announced a significant acceleration in demand for its 1.6T optical transceivers, driven by AI data centers, prompting a substantial expansion of its indium phosphide (InP) manufacturing. The company... -
Atomica Unveils AI Photonic Integration Platform to Resolve Optics-to-Packaging Bottlenecks in AI Hardware
The Data Center Engineer USA Overview Atomica has launched its 'AI Photonic Integration Platform' to address integration bottlenecks across photonics, electronics, memory, thermal structures, and package-level interfaces in AI infrastruc... -
Shanghai Jiao Tong University Simplifies Photonic-Electronic Integration with Reconfigurable Germanium-Silicon Photodetectors Using FOWLP
Technology News | Advanced Photonics Nexus (SPIE) China Overview Researchers at Shanghai Jiao Tong University have developed reconfigurable germanium-silicon photodetectors utilizing a low-loss integration strategy based on Fan-Out Wafer... -
NVIDIA and Broadcom Dominate 2026 CPO Supply Chain; TSMC’s COUPE Capacity Prioritized for AI Accelerators
SupplyICs USA Overview The 2026 Co-Packaged Optics (CPO) supply chain is facing severe challenges, characterized by a concentrated production landscape where NVIDIA and Broadcom largely control key platforms. A critical bottleneck stems ... -
The Photonics Foundry Frontier: Optical Chips Redefine AI Infrastructure, Driven by Strategic Material Innovations and Foundry Leadership
36Kr China Overview Chinese media outlet 36kr has published a comprehensive analysis of the evolving optical chip industry, identifying key material solutions like Silicon Photonics (SiPh), Indium Phosphide (InP), and Thin-Film Lithium N... -
A*STAR Accelerates Advanced Optical Interconnect Development for Co-Packaged Optics (CPO) in Singapore
MyCareersFuture Singapore Overview A*STAR Research Entities in Singapore are seeking a Senior Scientist to accelerate the development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms. This role invol...
