Wafer-level– tag –
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CPO Shipments Intensify as Four Foundries Pursue Diverse Paths in Next-Gen Optical Integration
MLQ News Global Overview As Co-Packaged Optics (CPO) shipments scale up, four major semiconductor foundries—TSMC, Intel, Samsung Foundry, and GlobalFoundries—are pursuing distinct strategies for next-generation optical integration. TSMC ... -
Lumentum CEO Flags Indium Phosphide Wafer Shortage; US Regulators Consider Banning Chinese Optical Transceivers, Potentially Benefiting Coherent and Other US Firms
Morningstar USA Overview Lumentum Holdings' CEO has warned that indium phosphide wafers, crucial for silicon photonics, could face a more severe supply crunch than memory semiconductors. Proactively, Lumentum has deposited $87 million wi... -
Nokia to Acquire NXP Arizona Wafer Fab, Bolstering U.S. Optical Communications Chip Manufacturing for AI and Cloud Markets
moomoo Community Finland, USA Overview Nokia announced plans to significantly expand its U.S. optical communications chip manufacturing capabilities through the lease and eventual acquisition of NXP Semiconductors' Arizona wafer fab camp... -
Micro-Transfer Printing Unlocks Scalable Heterogeneous Integration for Next-Gen Silicon Photonics: A Ghent University and imec Breakthrough
Photonics Online Belgium Overview Researchers from Ghent University and imec have validated micro-transfer printing (MTP) as a highly promising technique for heterogeneous integration in silicon photonics. MTP effectively merges precisio... -
Leading Foundries Accelerate Silicon Photonics Mass Production for AI/HPC Demand: UMC Ships First 12-inch Wafers, TSMC’s COUPE Enters Production
TrendForce Taiwan Overview Major foundries including TSMC, UMC, GlobalFoundries, and Tower Semiconductor are accelerating their silicon photonics efforts to meet the growing demand for data transmission bandwidth driven by increasing AI ... -
GlobalFoundries Secures $300M U.S. Department of Commerce Award to Accelerate Silicon Photonics R&D, Bolstering U.S. Leadership
GlobalFoundries USA Overview GlobalFoundries has signed a Letter of Intent with the U.S. Department of Commerce for a $300 million award from the CHIPS R&D Office. This funding aims to accelerate next-generation silicon photonics R&a... -
UMC Ships First Silicon Photonics Wafers, Tower Semiconductor Invests $3 Billion in Japan: AI Data Center Demand Accelerates Global Optical Tech Expansion
PhotonCap International Overview UMC has shipped its first mass-produced silicon photonics wafers from its Singapore 12-inch fab, while Tower Semiconductor announced a $3 billion investment in Japan to expand 300mm silicon photonics manu... -
Ion-Beam Origami Cuts 3D Optical Chip Fabrication to Seconds, Achieving >100x Speedup Over Conventional Methods
Intelligent Living International Overview Researchers have developed 'Ion-Beam Origami,' a technique capable of fabricating 3D photonic nanostructures across an entire wafer in mere seconds. This breakthrough achieves over 100x speed imp... -
YieldWerx Analyzes 2026 Photonics & Optical I/O Trends: In-Package Optical I/O Becomes Essential for AI Workloads
yieldWerx USA Overview YieldWerx has released an analysis of key trends and challenges in photonics and optical I/O for 2026, highlighting that optical interconnects are undergoing a dramatic shift from system-to-system to in-package com... -
STMicroelectronics Launches 300mm Wafer Production of PIC100 Silicon Photonics for AI Data Centers
EE Times International Overview STMicroelectronics has begun mass production of its PIC100 silicon photonics platform on 300mm wafers to meet the escalating demands of AI data centers. This platform integrates BiCMOS for laser drivers wi...
