Semiconductor Back-End Weekly Report May 13, 2026

Semiconductor Back-End Weekly Report September 20, 2026

Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge for Advanced 2.1D AI Semiconductor Packaging

Glass Substrates & TGV Technology Set to Reshape 2027 Advanced Packaging Race; US, Japan, Korea, Taiwan, China Accelerate Development

AI Infrastructure Component Crunch Becomes Reality: ABF Substrate Lead Times Hit 56 Weeks, Equipment Parts Up to 40 Months

Samsung Electro-Mechanics Unveils Next-Gen Package Substrate Technologies for AI & Servers at KPCA Show 2026, Highlighting Warp Reduction & High-Density Interconnects

AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion

BESI Hybrid Bonding System Orders Exceed 150 Units, HBM5 Onward to Accelerate Memory Adoption

Samsung’s zHBM Concept Promises 70% Lower I/O Power, 2.3x Bandwidth vs. HBM5 via Hybrid Bonding for Edge AI