July 2026– date –
-
Chiplet Underfill Dispensing Market to Grow Through 2036 Driven by HBM and C2W Hybrid Bonding Void Reduction Needs
Fact.MR USA Overview This article summarizes a market research report from Fact.MR. The chiplet underfill dispensing market is growing, driven by the need for wafer-level underfill in HBM manufacturing and tailored viscosity/cure profile... -
GM Mandates Specialized Adhesives for Corvette C8 Repairs, Signaling Industry Shift in Advanced Material Maintenance
Automobile Repair News USA Overview General Motors has issued a stringent directive requiring specific, validated adhesives for the Corvette C8's rear impact bar replacement, including specialized formulas for aluminum, Sheet Molding Com... -
SK Hynix to Launch Advanced Packaging Plant in Indiana, USA by H2 2028 to Meet Surging HBM3 Demand
BigGo Finance South Korea Overview SK hynix is driving aggressive capacity expansion to meet the surging demand for High Bandwidth Memory 3 (HBM3). The company plans to begin operations at an advanced packaging plant in Indiana, USA, by ... -
Silicone Foam for Lithium Battery Packs Market to Grow Through 2035, Driven by Thermal Runaway Regulations; EV Batteries Lead End-Use
IndexBox Unknown Overview This article outlines a market research report from IndexBox, projecting the silicone foam market for lithium battery pack assemblies to grow through 2035 due to escalating thermal runaway regulations. Electric ... -
Intel Seeks Senior Module Test Engineer in Kulim, Malaysia to Advance CUF Module Improvement and New Material Application for Advanced Packaging
Jooble USA Overview Intel is recruiting a Senior Module Test Engineer in Kulim, Malaysia, to lead the design and development of advanced manufacturing test processes. This role supports post-packaging burn-in, final test, and system test... -
AtlasPCB Releases BGA Underfill Selection Guide Comparing Capillary Flow and Reworkable Formulations for Automotive, Aerospace
AtlasPCB Unknown Overview AtlasPCB has published a BGA (Ball Grid Array) underfill selection guide as part of its PCB engineering insights blog series. The article comprehensively compares capillary flow, molded underfills, and reworkabl... -
Lenovo Legion Y70 2026 Gaming Phone Boosts Cooling with 12 W/mK Liquid Metal and High-Conductivity Gel
Cashkr China Overview The Lenovo Legion Y70 2026 gaming phone features a significantly enhanced cooling system, combining a 5,500 mm² vapor chamber with 12 W/mK liquid metal thermal conductivity and high thermal conductive gel. This setu... -
H.B. Fuller Acquires Advanced Medical Solutions for £660M, Bolstering Medical Adhesives Technology and Global Footprint
Perivan USA Overview H.B. Fuller announced its recommended cash acquisition of Advanced Medical Solutions Group plc (AMS), a UK-based developer and manufacturer of innovative tissue-healing technologies, for approximately £660 million. A... -
CuspAI Launches ‘AI Materials Foundry’ with Resonac and 45+ Partners to Accelerate Materials Discovery in Semiconductors, Energy, and Climate Change
Morningstar (Business Wire) UK Overview CuspAI has launched the 'AI Materials Foundry,' a global network to accelerate breakthrough materials discovery in semiconductors, energy, and climate change, with Resonac Holdings as a founding me... -
Sheen Technology Publishes Guide for ‘Punchable Silicone-Free Thermal Conductive Material’ for EV & AI Hardware Manufacturing
Sheen Technology Unknown Overview Sheen Technology has released a guide on selecting 'Punchable Silicone-Free Thermal Conductive Material' for high-capacity electronics manufacturing. This material is gaining importance as an alternative...
