July 2026– date –
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NC State Develops AI-Enabled, 1650°C-Resistant Wireless Ceramic Sensor for Extreme Environments
NC State News USA Overview Researchers at NC State University have developed an innovative metasurface-patterned ceramic sensor capable of wireless temperature sensing and enduring temperatures up to 1,650°C. This breakthrough sensor lev... -
IISc Researchers Develop Smart Materials Responsive to Light, Heat, and Pressure, Eyeing Quantum Processors and Advanced Sensors
The Hindu India Overview Researchers at the Indian Institute of Science (IISc) have developed new smart materials that can reversibly alter their physical properties in response to light, heat, and mechanical pressure. This breakthrough ... -
MIT Researchers Uncover Stable Multiple Superconducting States in Graphene, Paving Way for Advanced Material Design
MIT News USA Overview MIT researchers have discovered that graphene with a specific microstructure can stably host multiple superconducting states simultaneously, a rare phenomenon in nature. This graphene maintains its superconductivity... -
LOCTITE® Unveils Leak-Free Anaerobic Sealants for Hydrogen Systems: A Next-Gen Solution with Pressure, Temperature, and Vibration Resistance
Assembtek Germany Overview The LOCTITE® brand has launched anaerobic sealants as a next-generation solution for hydrogen system sealing. These sealants cure in the absence of air between metal surfaces, forming durable, leak-free thermos... -
Dow Unveils TC-3120 High-Performance Thermal Gel for Data Centers: High Thermal Conductivity and Excellent Flowability to Address AI and Big Data Challenges
Assembtek USA Overview Dow has launched TC-3120, a high-performance thermal gel specifically engineered for thermal management in data center chips, servers, and high-speed optical modules (400G/800G). This thermal gel features exception... -
TrendForce Reports Samsung Files New HBM Dummy Die Patent to Enhance 16-Layer HBM5 Stack Reliability
TrendForce Taiwan Overview TrendForce reports that Samsung has filed a new HBM dummy die patent aimed at enhancing 16-layer HBM5 stack reliability. This patent seeks to address warpage and heat dissipation issues in high-stack configurat... -
SK Hynix’s Advanced MR-MUF Packaging Process Reduces HBM4 Thermal Resistance by 17%, Contributing to AI Accelerator Chip Stabilization
Kynix China Overview SK Hynix's Advanced MR-MUF (Mass Reflow Molded Underfill) packaging process has been shown to reduce HBM4 thermal resistance by 17% compared to conventional HBM4. This innovative technology is crucial for maintaining... -
MDPI Publishes Research on Improving Lithium-Ion Battery Bottom Guard Plate Impact Protection Using Structural Adhesives
MDPI Switzerland Overview Research published in MDPI explores the use of structural adhesives to enhance the impact protection performance of lithium-ion power battery bottom guard plates. The study found that stronger adhesive bonds sig... -
Kynix Explains HBM4 Hybrid Copper Bonding Achieves Over 20% Thermal Performance Improvement, Enabling Stable Clock Speeds Under AI Loads
Kynix China Overview Kynix explains that Hybrid Copper Bonding (HCB) technology for HBM4 improves thermal performance by over 20%. This method eliminates solder bumps and underfill, directly connecting copper layers to significantly redu... -
Samsung Announces HBM4E Hybrid Copper Bonding Reduces Package Height by Over 15% While Improving Thermal Characteristics
Sammy Fans South Korea Overview Samsung has presented research on its HBM4E packaging strategy, emphasizing that Hybrid Copper Bonding (HCB), which eliminates underfill materials, offers superior thermal properties compared to convention...
