July 2026– date –
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Henkel Unveils Low-Viscosity Technomelt PA 6370 Hot Melt Adhesive for Precision Small-Gap Protection in Electronic Assemblies
Adhesives/Sealants.org (Henkel) Germany Overview Henkel has introduced Technomelt PA 6370, a new polyamide-based, low-viscosity hot melt adhesive specifically developed for sealing narrow gaps and intricate electronic components. This in... -
Sika Corporation and Georgia-Pacific Partner to Launch Innovative EIFS Featuring DensElement® Barrier System
Sika USA USA Overview Sika Corporation announced a strategic collaboration with Georgia-Pacific Building Products to co-launch a new Exterior Insulation and Finish System (EIFS) integrating Georgia-Pacific's innovative DensElement® Barri... -
Geisys Ventures’ D-Glue Introduces Debondable Adhesive to Revolutionize End-of-Life Product Repair and Recycling
Design World USA Overview Geisys Ventures' D-Glue has developed an innovative debondable adhesive technology that allows for easy separation of components after use. This breakthrough significantly simplifies product rework, repair, and ... -
R2 Sealant Systems Launches New R-Series High-Performance Sealant and Adhesive Line for Construction, Industrial, and Manufacturing Sectors
R2 Sealant Systems USA Overview R2 Sealant Systems has officially launched its new R-Series product line, a comprehensive portfolio of high-performance sealants and adhesives designed for the construction, industrial, and manufacturing i... -
Resonac Joins Consortium to Pioneer Semiconductor Manufacturing in Low Earth Orbit with BEAM TECHNOLOGIES and Japan LEO Shachu
Resonac Japan Overview Resonac, alongside BEAM TECHNOLOGIES and Japan LEO Shachu, has signed an MOU to explore semiconductor manufacturing in Low Earth Orbit (LEO), leveraging microgravity for advanced material properties. This collabora... -
Resonac to Boost High-Purity HF Gas Production Capacity at Tokuyama Plant by 2026 Amid Surging Semiconductor Demand
Resonac Japan Overview Resonac announced it will enhance its production system for high-purity hydrogen fluoride (HF) gas at its Tokuyama Plant starting in 2026 to meet the escalating global demand for semiconductors. This strategic inve... -
Ajinomoto Fine-Techno Presents Advancements in ABF Film for AI Semiconductor Packaging, Supporting High-Performance Evolution
SEMI Global News Japan Overview Ajinomoto Fine-Techno has announced its latest advancements in ABF (Ajinomoto Build-up Film) technology for AI semiconductor packaging, contributing to higher performance and reliability in AI processors. ... -
Development of PFAS-Free Sealants for High-Performance Electronics Advances, Driving Regulatory Compliance and Safer Materials Shift
Environmental Science & Technology Letters Global Overview A groundbreaking paper has been published on the development of PFAS-free (per- and polyfluoroalkyl substances) sealants for high-performance electronics. This research aims to a... -
New Low-Temperature Sintering Die Attach Material Revolutionizes IGBT Module Manufacturing for Enhanced Performance
Advanced Power Semiconductor Technology Global Overview A new low-temperature sintering die attach material for IGBT modules has been announced, offering high thermal conductivity and reliability while reducing stress on heat-sensitive c... -
Henkel Invests in Automotive Structural Adhesives Capacity Expansion, Accelerating Multi-Material Lightweighting
Adhesives & Sealants Industry Germany Overview Henkel has announced a strategic investment in expanding its production capacity for automotive structural adhesives to meet the growing demand for lightweighting and dissimilar material joi...
