July 2026– date –
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Novel Anisotropic Conductive Film (ACF) Developed for Fine Pitch Display Bonding, Paving Way for MicroLED Devices
Display Technology News Global Overview A novel Anisotropic Conductive Film (ACF) has been developed for fine pitch display bonding, enabling finer connections and higher reliability. This ACF is capable of achieving both miniaturization... -
Fraunhofer Institute Advances Debondable Adhesives for Electronics Recycling, Boosting Material Recovery
Fraunhofer Press Release Germany Overview Researchers at the Fraunhofer Institute have announced significant advancements in debondable adhesive technology, poised to dramatically improve electronics recycling efficiency. This technology... -
Dymax Unveils Low-Outgassing UV Curable Adhesive for Optical Sensors, Boosting AR/VR Device Performance
Photonics Spectra USA Overview Dymax has released a new low-outgassing UV curable adhesive designed for optical sensor assemblies in AR/VR devices and medical equipment. This adhesive drastically minimizes volatile organic compound (VOC)... -
BASF Unveils Toughened Structural Adhesive for Multi-Material Automotive Lightweighting, Enhancing Crash Durability
Automotive Engineering International Germany Overview BASF has launched a new toughened structural adhesive aimed at multi-material automotive lightweighting applications. This adhesive robustly bonds dissimilar materials like aluminum a... -
Dow Launches Silicone-Free Thermal Gap Filler for EV Batteries, Mitigating Thermal Runaway Risk
Electrification & Hybrid Vehicle Technology USA Overview Dow has launched a new silicone-free thermal gap filler specifically developed for electric vehicle (EV) battery packs. This product maximizes heat transfer efficiency between batt... -
New Silver Sinter Paste Revolutionizes Thermal Management for SiC Power Modules, Boosting EV and Renewables
Power Electronics Magazine Global Overview A new silver sinter paste with high thermal conductivity and excellent reliability has been unveiled for SiC (silicon carbide) power modules. This advanced bonding material significantly enhance... -
Novel Low-CTE Epoxy Molding Compound Developed to Tackle Warpage in Large AI Semiconductors
Journal of Materials Science & Technology Global Overview Researchers have developed a novel low-coefficient of thermal expansion (CTE) epoxy molding compound specifically for encapsulating large dies such as HBM and AI semiconductors. T... -
Henkel Unveils High-Performance Underfill Material for Advanced Logic and Memory Packaging, Boosting Production Efficiency
Advanced Packaging Journal Germany Overview Henkel has introduced a new high-performance underfill material designed for advanced logic and memory packaging technologies like flip-chip and chiplets. This material significantly improves d... -
Rocket Lab Aborts Launch of Japan’s iQPS SAR Satellite ‘QPS-SAR-13’ at T-0, Cause Undetermined
Space.com Japan Overview Rocket Lab aborted the launch of Japan's Earth observation SAR satellite 'QPS-SAR-13' (Mikura-I) from iQPS at the final stage of the countdown. The launch, scheduled from Rocket Lab's Launch Complex 1B in New Zea... -
ESA Supports Microgravity Automated Screening & Tissue Modeling (MAST) Feasibility Study to Accelerate Drug Discovery in Neurodegeneration and Oncology
ESA Space Solutions Europe Overview ESA Space Solutions is supporting the Microgravity Automated Screening & Tissue Modeling (MAST) feasibility study to assess Exobiosphere's proposed On-Orbit High-Throughput Screening (OHTS) platfor...
