September 2026– date –
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Photonic Integrated Circuits Poised as Next Frontier in Optoelectronics, Driven by Miniaturization and Enhanced Functionality
Optics.org UK Overview Photonic integrated circuits (PICs) are rapidly advancing in miniaturization and per-chip functionality due to significant progress in design, simulation, and manufacturing. These devices, serving as the photonic e... -
MIT Breakthrough: Scalable Manufacturing Platform Enables Flexible, Transparent Silicon Photonics for Wearables and AR Displays
MIT News USA Overview MIT researchers have developed a scalable manufacturing platform for flexible and transparent silicon photonics chips, compatible with existing semiconductor fabrication processes. This innovation promises to revolu... -
AI-Driven Hyperscale Demand Triggers Surge in Optical Transceiver Investment and Strategic M&A, Led by NVIDIA and Marvell
GlobeNewswire USA Overview The escalating demand from AI workloads is fueling a rapid acceleration in investment and strategic M&A within the optical transceiver market, reshaping global connectivity infrastructure. NVIDIA invested $... -
Semiconductor Engineering Analyzes: Photonics Forces Chiplet Rethink, Multi-Physics Co-Design to Solve Thermal, Stress, Alignment Challenges
Semiconductor Engineering USA Overview Semiconductor Engineering reports that the integration of photonics is fundamentally forcing a reevaluation of chiplet design. Due to the bidirectional interaction of thermal, mechanical, electromag... -
Marvell Expands Photonic Fabric with Google TPU Ecosystem Partnership, 8 Tbps Optical I/O Chiplet Demo, and Celestial AI Acquisition
FUNDA | Substack USA Overview Google and Marvell announced a strategic partnership for custom silicon programs connecting to the TPU ecosystem, leading Marvell to significantly increase its FY27 revenue outlook for scale-up optics. Ayar ... -
SEMICON Taiwan Focuses on Silicon Photonics and Co-Packaged Optics (CPO) for AI Infrastructure; Foxconn to Ship CPO Switches in Q3
CNA Taiwan Overview SEMICON Taiwan 2026 announced its primary focus on silicon photonics and Co-Packaged Optics (CPO) technologies to meet the explosive demand from AI infrastructure. Key highlights include advancements in TSMC's Compact... -
BigGo Finance Report: AI Compute Interconnect at Inflection Point, NPO and CPO Reshaping Industry Value Chain
BigGo Finance USA Overview According to a BigGo Finance report, AI compute interconnects are at a critical inflection point, with Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) fundamentally reshaping the industry value chain. C... -
POET Technologies to Showcase AI and Data Center Photonics at CIOE 2026, Focusing on High-Power Multi-Wavelength Laser Sources
Stock Titan (POET SEC Filing) Canada Overview POET Technologies announced its plans to showcase innovative photonics products for the AI and data center markets at the China International Optoelectronic Exposition (CIOE) from September 9... -
Credo Technology Group Joins Open CPX MSA to Drive Interoperable Optical Interconnect Development for Next-Gen AI Infrastructure
Business Wire USA Overview Credo Technology Group announced its participation in the Open Co-packaged Interface Multi-Source Agreement (Open CPX MSA) to support the development of interoperable near-packaged and Co-Packaged Optics (CPO) ... -
Kulicke & Soffa Enhances Thermal Compression Bonding (TCB) Technology for Co-Packaged Optics (CPO) to Boost AI Infrastructure
PR Newswire USA Overview Kulicke & Soffa (K&S) announced it is enhancing its advanced packaging portfolio, including Thermal Compression Bonding (TCB) solutions, for Co-Packaged Optics (CPO) applications to meet soaring AI infras...
