Key Findings
Sumitomo Bakelite is increasing its global supply capabilities for advanced semiconductor encapsulation materials by installing new production lines in Suzhou, China, and Singapore. Following these expansions, the company expects its production capacity for MUF materials to approximately double and its capacity for compression-molding granules to approximately triple compared to current levels.
Technical Details
The expansion focuses on two primary product lines: SUMIKON™ EME mold underfill (MUF) materials and compression-molding granules. The implementation timeline is as follows:
- Suzhou, China: New production lines will be installed at the new plant completed in 2024, with production scheduled to begin in fiscal 2030.
- Singapore: New production lines will be installed within the existing plant, with production scheduled to begin at the end of fiscal 2028.
Technically, the MUF materials are designed for high reliability and manufacturing efficiency by filling solder joints and encapsulating the package in a single molding process, offering low-warpage characteristics and high filling performance in microscopic gaps. The compression-molding granules utilize optimized filler size, resin viscosity, and particle-size distribution to ensure uniform molding and low warpage for large panels.
Background & Context
The investment is driven by the rapid growth of advanced semiconductors used in communications satellites and generative AI, particularly in Southeast Asia and China. These applications require semiconductor packages that are increasingly large, thin, and dense, necessitating materials that can maintain structural integrity and productivity during manufacturing.
Significance & Outlook
To further strengthen its supply chain, Sumitomo Bakelite is also executing the acquisition of Kyocera Corporation’s chemical business at the end of October, which will add further capacity for both MUF and compression-molding granules. These combined initiatives aim to secure a robust global supply system across Japan, China, and Southeast Asia to capture growing market share in the advanced semiconductor sector.
Source: https://www.sumibe.co.jp/english/topics/2026/it-materials/1007_01/index.html
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