2026– date –
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NC State thin-film: Lead Azobenzene vs Silicon insulation specs
SciTechDaily USA Overview North Carolina State University researchers have developed a novel thin-film material that defies conventional materials science by combining exceptionally high stiffness with extremely low thermal conductivity.... -
Electron Density Drives ML to 64% Greater Accuracy in Molecular Spectrum Prediction
Preprint (arXiv) Unknown Overview A recent preprint on arXiv unveils a machine learning approach that leverages electron density to predict molecular absorption spectra with significantly higher accuracy than traditional geometry-based m... -
β-Ga2O3 MOSFETs: 80x heat transfer area strategy explained
Southwest Jiaotong University China Overview Researchers at Southwest Jiaotong University, led by Associate Professor Hongkun Li, have devised a hybrid thermal management strategy for β-Ga₂O₃ MOSFETs that combines a diamond thermal sprea... -
Intel EMIB-T: Specs for 25μm bump pitch and 64Gb/s UCIe
EBest Circuit China Overview Intel's EMIB-T substrate technology has reported significant development results at ECTC 2026, featuring a 25 μm first-level interconnect bump pitch and 120 × 120 mm package dimensions. This advanced packagin... -
Bergquist HI-FLOW THF 1600P: Henkel’s 20-40% failure reduction
Henkel Adhesive Germany Overview Henkel's Bergquist® HI-FLOW THF 1600P phase-change thermal interface material (TIM) has been successfully deployed in next-generation motor controllers, effectively managing high power densities and meeti... -
Resonac 300mm SiC: Cost and area vs 150mm wafers for AI/HPC
SemiMedia Japan Overview Resonac Holdings has successfully developed Japan's first 300mm single-crystal silicon carbide (SiC) substrate, representing a major leap in semiconductor manufacturing. This 12-inch wafer provides approximately ... -
Master Bond EP48TC: Thermal resistance specs for 2026 epoxy
Master Bond Inc. USA Overview Master Bond has launched EP48TC, a high-performance, two-component epoxy paste engineered to achieve an exceptionally low thermal resistance of 5-7 x 10⁻⁶ K•m²/W, even when applied in bond lines as thin as 1... -
Perovskite: Solar cell stability and 27.39% efficiency results
FLASH24 International Overview Recent perovskite solar cell research demonstrates a significant advance, achieving a high power conversion efficiency of 27.39% through novel molecular design, alongside progress in resolving long-term sta... -
Perovskite: Underwater solar cell specs and 34.71% efficiency
Physics World / NOW.solar International Overview A polymer-tuned wide-bandgap perovskite solar cell has achieved a record-breaking 34.71% power conversion efficiency in an underwater environment. This novel technology significantly surpa... -
Toshiba: 3300V SiC MOSFET specs and 40% thermal resistance cut
Magazine Industry USA Japan Overview Toshiba Device & Storage Corporation has unveiled a new 3300V SiC MOSFET module incorporating silver sintering die-attach technology. This module achieves up to a 40% reduction in thermal resistan...
