2026– date –
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SpaceX Starship: 18,000 heat shield tiles and reusability specs
RocketSTEM USA Overview SpaceX's Starship underwent a rigorous re-entry test during its first orbital flight, evaluating its heat shield composed of approximately 18,000 hexagonal silica ceramic tiles. Engineers reinforced tile installat... -
Berkeley Lab: 900°C heat shield 3D X-ray imaging explained
sciencesprings USA Overview Researchers at Lawrence Berkeley National Laboratory have successfully developed a technique using X-ray micro-computed tomography and AI to visualize, in real-time and 3D, the degradation of spacecraft heat s... -
PEGA-SUS1: China’s 2026 on-orbit AI data processing roadmap
Chinadaily.com.cn China Overview As the AI infrastructure race extends beyond terrestrial data centers to space, China reported new progress in on-orbit data processing with the launch of its experimental 'PEGA-SUS1' satellite on Septemb... -
USC Cooling Material: 600°C spacecraft heat radiation specs
USC Viterbi | School of Engineering USA Overview Engineers at the University of Southern California (USC) have developed an innovative material system capable of withstanding temperatures exceeding 600°C while efficiently radiating heat ... -
MULE Microreactor: 1,000°C lunar base heat and ISRU specs
Universe Today (arXiv preprint) USA Overview A new paper on arXiv by Julius Mercz et al. proposes a 1,000°C lunar microreactor, named MULE (Molten Salt Electrolysis Unit and Reactor), designed to power the next generation of moon bases. ... -
Project Suncatcher: Google’s 2026 TPU AI chip space durability
Google Blog (Google Research) USA Overview Google has launched its prototype "Project Suncatcher" satellite, equipped with Tensor Processing Units (TPUs), to evaluate the durability and performance of AI hardware in the harsh space envir... -
Brewer Science: High-temp laser debonding specs for IMAPS 2026
Brewer Science USA Overview Brewer Science presented new data at IMAPS 2026 on its high-temperature resistant laser debonding materials specifically designed for advanced packaging Temporary Bonding/Debonding (TBDB) applications. This ne... -
Resonac: First Japanese 12-inch SiC single crystal substrate
Semicon electronics Japan Overview Resonac Holdings announced the successful manufacturing and subsequent substrate processing of a 300mm (12-inch) SiC single crystal on September 15, 2026. This achievement marks a first for a Japanese c... -
ERS electronic: Automated PLP system for 310x310mm substrates
Chiplet Marketplace Germany Overview ERS electronic has introduced a fully automated Panel-Level Packaging (PLP) system designed to enhance AI and chiplet architectures. This innovative system handles 310x310mm substrates, integrating th... -
JDI Mobara Plant: Shinko Electric and FICT 2028 operation plan
EE Times Japan Japan Overview Shinko Electric Industries and FICT have acquired Japan Display's (JDI) Mobara plant in Chiba Prefecture, designating it as a core facility for advanced AI semiconductor packaging, with operations slated to ...
