Key Findings
The AS9378X5 series pressureless sintering silver paste has achieved an intrinsic thermal conductivity of 326.75W/m·K, setting a new performance benchmark for domestic pressureless sintering silver. The material exhibits a thermal diffusivity of 69.1mm²/s and maintains a porosity level below 3%, resulting in a density close to that of bulk pure silver.
Technical Details
Verification was conducted using the TPS transient plane source (Hot Disk) standard method with a 50mm×50mm pure copper substrate sandwich structure. The material’s mechanical and process specifications include:
- Mechanical Strength: Sintered joint shear strength exceeds 35MPa.
- Thermal Stability: Capable of withstanding thermal cycle shocks across a wide temperature range from -55℃ to 175℃, meeting automotive-grade power device reliability requirements.
- Process Consistency: During continuous 8-hour printing, viscosity fluctuation remained below 8%, producing uniform thickness and clean line edges for mass production.
Background and Context
Unlike traditional pressure-sintering silver pastes that require external pressure to achieve densification, the AS9378X5 series completes the process under standard reflow oven conditions. This pressureless approach is specifically designed for low-stress packaging of large-size SiC power chips and IGBT modules, reducing the risk of stress damage to thin chips and ceramic substrates.
Significance and Outlook
The AS9378X5 series is IATF16949 certified and currently serves multiple power semiconductor packaging companies in the Yangtze River Delta. Applications span electric vehicle drive controllers, photovoltaic energy storage inverters, 5G RF power amplifier modules, and industrial power supplies. By breaking the technical monopoly of overseas manufacturers, this material reduces costs and delivery cycles for the domestic power semiconductor industry. As SiC devices move toward higher power densities and operating temperatures, high-thermal-conductivity pressureless sintering silver is becoming a standard core material for power packaging.
Source: https://news.cnpowder.com.cn/91931.html
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