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Advanced Packaging Warpage Mitigation: Research Advances in Incorporating Negative Coefficient of Thermal Expansion Materials into Epoxy Molding Compounds and Underfills
Semiconductor Engineering USA Overview Active research is progressing on utilizing negative coefficient of thermal expansion (CTE) materials in epoxy molding compounds (EMC) and underfills to effectively mitigate warpage in large semicon... -
NIST and UCSD Develop Predictive Modeling for Cure Behavior and Thermal Endurance of Advanced Packaging Epoxy Underfills
Semiconductor Engineering USA Overview Researchers from the National Institute of Standards and Technology (NIST) and the University of California San Diego (UCSD) have published a technical paper detailing a new modeling technique to ac... -
SK Hynix Breakthrough: Mass Reflow Underfill Molding Overcomes HBM Stacking Thermal Challenges, While Micron’s Hybrid Bonding Slashes Power Consumption by 30%
CSIS USA Overview SK Hynix has established a lead in HBM chip stacking by investing heavily in 'Mass Reflow Underfill Molding' (MR-MUF), a novel packaging technique that resolves the thermal and physical constraints of multi-die HBM stac... -
NASA’s Lunar Base Plan Eyes Sunpower’s Stirling Radioisotope Generator for Crucial Power
The Motley Fool USA Overview NASA is soliciting proposals for key nuclear power technologies, including Stirling Radioisotope Generators (RSGs), for its long-term lunar base plans. Sunpower, a subsidiary of Ametek, is a strong candidate,... -
LandSpace Achieves China’s First Ground-Controlled Booster Recovery with Zhuque-3 Rocket, Advancing Reusability
Tech Trends (South China Morning Post) China Overview Chinese private aerospace firm LandSpace successfully executed China's first ground-controlled recovery of its Zhuque-3 rocket booster in August 2026, utilizing landing legs akin to S... -
Rocket Lab Successfully Launches 16th Mission of the Year, Deploying Earth Observation Satellite for Undisclosed Customer
Space.com New Zealand Overview Rocket Lab successfully launched an Earth observation satellite for an undisclosed customer on September 10, 2026, marking its 16th mission of the year. The 'Happily Ever Faster' mission utilized an Electro... -
NASA Launches Call for Proposals to Accelerate Moon Base Technologies, Focusing on Vertical Solar Arrays, ISRU Oxygen Extraction, RSG, Advanced Manufacturing, and Nanomaterials
MeriTalk USA Overview NASA has issued a solicitation for proposals under its Lunar Enabling Infrastructure Accelerator to advance technologies for a sustainable Moon base at the lunar South Pole. The five key areas targeted are vertical ... -
IBM and NASA Open-Source Multimodal AI ‘Lunar Foundation Model’ for Moon Mapping, Accelerating Lunar and Mars Missions
IBM Research USA Overview IBM and NASA have open-sourced the 'NASA-IBM Lunar Foundation Model,' a multimodal AI model designed for mapping the Moon, integrating decades of data from U.S. and Japanese missions. This model is engineered to... -
Helogen to Launch Two October Space Missions for In-Space Manufacturing of Artificial Retinas and Orthopedic Implants
LA Business Journal USA Overview Startup Helogen announced it will launch two space missions in October for manufacturing artificial retinas and orthopedic implants in microgravity. These missions aim to explore the production of more pr... -
BAE Systems Secures $16M to Restore RH45 Radiation-Hardened Chip Capability, Bolstering US Supply Chain
Defense Industry Europe USA Overview BAE Systems announced it received $16 million from the Department of Defense to restore and strengthen its RH45 radiation-hardened semiconductor manufacturing capability. This investment aims to estab...
