New Technology– category –
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Toughened T-Link: L&L Products carbon fiber impact specs
Pulse 2.0 USA Overview L&L Products has introduced Toughened T-Link, an amorphous thermoplastic adhesive designed to enhance the performance of laminated epoxy carbon-fiber composites. Internal testing showed that composite panels in... -
Teroson MS 940: Henkel’s isocyanate-free adhesive specs
Henkel Adhesive Technologies Germany Overview Henkel has launched Teroson MS 940, a high-performance isocyanate-free adhesive and sealant for rail and industrial applications. This new product surpasses the mechanical performance of stan... -
Materials AI: Foundation models for clean energy challenges
AZoM (ChemRxiv preprint server) USA Overview A recent ChemRxiv preprint explores the evolution of AI in materials science, discussing the transition from narrow, task-specific machine learning models to broader foundation models applicab... -
DOWSIL TC-5533: Dow thermal gap compound vs Henkel offerings
openPR.com (Future Market Insights) USA Overview Material innovation in the thermal gap compound market focuses on developing high thermal conductivity and eco-friendly products, especially for battery pack assemblies. Dow offers DOWSIL ... -
Henkel EV Adhesives: 2026 thermal gap filler specs explained
Kings Research USA Overview Henkel launched two high thermal conductivity materials for electric vehicles (EVs) in May 2026: Bergquist TGF 2030APS thermal gap filler (1.7 W/m·K) and Loctite TLB 9270APS thermal conductive adhesive (2 W/m·... -
Birjand University: Plant nanocatalyst for water antibiotics
Tech Xplore (Birjand University of Medical Sciences) Iran Overview Researchers at Birjand University of Medical Sciences have developed a plant-based magnetic photocatalyst capable of completely removing ciprofloxacin antibiotics from wa... -
Virginia Tech: 4x stronger recyclable duct tape adhesives
Phys.org USA Overview Virginia Tech researchers have developed two innovative adhesives: one is four times stronger than commercial duct tape adhesive and degrades in minutes with weak alkaline water, while the other enables co-recycling... -
Researchers Develop Wafer-Scale Bonded Active Photonics Interposer: Pioneering Low-Loss, High-Bandwidth Optoelectronic Integration
EurekAlert! USA Overview Researchers have developed a wafer-scale bonded active photonics interposer that integrates photonic devices with electronic circuits at the wafer level, enabling low-loss, high-bandwidth communication with mass ... -
Tyndall National Institute Unveils Three Papers at ESTC 2026 Advancing Photonic Packaging and Chiplet Integration
Tyndall National Institute Ireland Overview Researchers from Tyndall National Institute presented three pivotal papers at ESTC 2026, showcasing significant innovations in photonic packaging, co-packaged optics, and chiplet integration te... -
TESA Unveils Innovative Adhesive Solutions to Meet Demands of Miniaturized and Complex Electronic Devices
TESA Germany Overview TESA is showcasing its innovative electronic adhesive solutions engineered for bonding, mounting, sealing, cushioning, shielding, and encapsulation in increasingly small and complex electronic devices. These solutio...
