New Technology– category –
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Taiyo Holdings Achieves First 700nm CD Three-Layer RDL Formation on 12-Inch Wafers with New FPIM Series for Advanced Semiconductor Packaging
Morningstar (Taiyo Holdings Co. Ltd.) Japan Overview Taiyo Holdings has launched its "FPIM Series" next-generation semiconductor-packaging material, achieving the industry's first three-layer Redistribution Layer (RDL) formation with a 7... -
KAIST Engineers E. coli to Produce Glucose-Based Biodegradable Hot-Melt Adhesives, Outperforming Petroleum Counterparts
Mirage News (referencing KAIST) South Korea Overview KAIST researchers have developed a glucose-based adhesive as an alternative to petroleum-derived hot-melt adhesives by genetically engineering *Escherichia coli* to produce novel aroma... -
NovoLINC Unveils MaxLINC, Achieving Industry-Leading 0.7 mm²•K/W Thermal Resistance for Multi-Kilowatt AI Chips
PR Newswire (NovoLINC) Unknown Overview NovoLINC has launched MaxLINC, an advanced thermal interface material (TIM) designed for high-performance AI computing, achieving an industry-leading thermal resistance as low as 0.7 mm²•K/W. This ... -
Penn State and Kurt J. Lesker Company Form Atomic-Scale Processing Hub for Semiconductors and Quantum Tech
Penn State USA Overview Penn State University and Kurt J. Lesker Company have established a strategic partnership to accelerate advanced atomic-scale processing methods crucial for semiconductors, advanced packaging, quantum, and photoni... -
Gel-Based Cooling Pad Market Poised for Growth Through 2035, Driven by Biopharma Cold Chain and EV Demand
IndexBox Global Overview The global gel-based cooling pads market is projected for substantial growth through 2035, primarily fueled by the expanding biopharma cold chain, consumer electronics, and electric vehicle (EV) battery pack appl... -
Samsung Electro-Mechanics and Qualcomm Jointly Develop Organic Bridge Technology for 2.1D AI Semiconductor Packaging
The Elec South Korea Overview Samsung Electro-Mechanics and Qualcomm are collaboratively developing an advanced "organic bridge" technology for 2.1D packaging in AI semiconductors. This innovation utilizes organic materials, akin to PCBs... -
KAIST Develops Smartphone-Controlled Adhesive Microneedle Electronic Medicine for Remote Pain Management
Ground News (Yonhap News Agency) South Korea Overview A KAIST-led research team, in collaboration with the Korea Institute of Oriental Medicine, has developed an adhesive microneedle electronic medicine for smartphone-controlled remote p... -
TESA Revolutionizes Car Design and Assembly with Advanced Automotive Adhesives for EV Electrification and HMI Evolution
TESA Germany Overview TESA's advanced automotive adhesive solutions are crucial for the evolving car design and assembly, especially with the shift towards electric vehicles (EVs) and sophisticated human-machine interfaces (HMI). Their c... -
Taiyo Holdings Launches Next-Gen Semiconductor Packaging Material ‘FPIM Series,’ First to Achieve 700nm CD Three-Layer RDL on 12-inch Wafers
PR Newswire Japan Overview Taiyo Holdings, in collaboration with imec, has launched its "FPIM Series," a next-generation semiconductor packaging material that enables the first successful formation of a three-layer Redistribution Layer (... -
Global Battery Manufacturing Reaches 4 TWh as Adhesives for EV Battery Pack Integration Gain Critical Industrial Relevance
24ChemicalResearch Unknown Overview As global battery manufacturing reaches 4 terawatt-hours (TWh), adhesives for EV battery pack integration are gaining critical industrial relevance, driven by the shift towards cell-to-pack (CTP) archi...
