New Technology– category –

AZoM Germany Overview DELO has introduced DELO PHOTOBOND PS4140, the world's first liquid pressure-sensitive adhesive (PSA) specifically for fixing gas diffusion layers (GDL) in fuel cells. This innovative product replaces traditional ta...

Fraunhofer FFB Germany Overview The Fraunhofer FFB's UVPolyZell project has successfully developed a polymer binder system for NMC cathodes in lithium-ion batteries that completely eliminates toxic NMP solvents and fluorine-based PVDF po...

Adsale Plastics Asia Overview Japanese chemical giants Sumitomo Chemical and Asahi Kasei are accelerating investments and innovations in semiconductor and AI materials. Sumitomo Chemical, in collaboration with Gutenberg Co., Ltd., develo...

36Kr China Overview Chinese AI new materials firm SOG Intelligence secured tens of millions of yuan in angel round financing, integrating AI computing engines for R&D focused on photoresist and semiconductor packaging adhesives. Its ...

Shanghai Metals Market (SMM) News China Overview Multiple Chinese entities have announced significant advancements in solid-state battery technology, with Sichuan University reporting ultra-high-nickel all-solid-state batteries exceeding...

3D InCites USA Overview Indium Corporation experts will present advanced materials solutions for advanced packaging, AI, and high-performance computing (HPC) at the IMAPS Symposium. Solutions include ultra-low residue flux for micro-bump...

SEMI USA Overview Four finalists from SEMI Startups for Sustainable Semiconductors presented groundbreaking innovations at SEMICON West 2026. HEXAspec Inc. achieved a 10x improvement in thermal conductivity with hBN nanosheet-polymer enc...

Brewer Science USA Overview Brewer Science will present new data at IMAPS 2026 on a high-temperature-stable laser release material, designed for advanced packaging processes from 250°C to 350°C. This material supports demanding processes...

YINCAE (via Electronics Media) USA Overview YINCAE unveiled its UV-curable underfill technologies, UF 66UV and UF 88UV, at IMAPS 2026. UF 66UV offers high-speed processing and robust reliability for advanced electronic packaging. Notably...

3D InCites Germany Overview Heraeus has unveiled a new approach to scalable silver sintering for next-generation power modules, addressing the critical challenge of balancing throughput with precision. By optimizing precise paste deposit...