Adhesives & Sealants– category –
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Sumitomo Chemical Unveils ‘ELA Series’ High-Purity Alumina for Advanced Semiconductors
AL Circle Japan Overview Sumitomo Chemical has launched the ELA Series, a new range of high-purity alumina products targeting advanced semiconductor manufacturing for AI and high-performance electronics. This series represents the world'... -
Henkel Launches High-Performance Structural Adhesive for Automotive Body-in-White Assembly
Assembtek Germany Overview Henkel has introduced the Teroson EP 52 Series, a new structural adhesive designed for automotive Body-in-White (BIW) production. This heat-curable, solvent-free, one-component adhesive significantly enhances s... -
Adhesives & Sealants Weekly Report May 18, 2026
📄 Weekly Report May 18, 2026 (PDF) — Download Weekly Report May 18, 2026 (PDF) — DownloadDownload 🎙 Podcast May 17, 2026 (MP3) — Play & Download Adhesives_SealantsEnglishPodcast_20260517_sample.mp3Download View Past Weekly Reports→ -
Resonac Raises Mid-Year Profit Outlook, Driven by Robust Demand for AI Semiconductor Materials
レゾナック Japan Overview Resonac announced a significant upward revision to its consolidated net profit forecast for the first half of 2026, from 20 billion JPY to 38 billion JPY, driven by strong performance in its AI semiconductor mat... -
ASMC 2026 Convenes Global Semiconductor Leaders to Tackle Advanced Manufacturing Challenges and Accelerate Innovation
SEMI USA Overview The Advanced Semiconductor Manufacturing Conference (ASMC 2026), held from May 11-14, brought together semiconductor manufacturers, equipment and materials suppliers, and academia to discuss innovative strategies and me... -
Henkel Unveils Sustainable Sealants for Beverage and Food Cans at METPACK 2026, Meeting Evolving Safety and Efficiency Demands
Henkel Germany Overview Henkel introduced its next-generation, eco-friendly sealants for beverage and food cans at METPACK 2026. New offerings include water-based Darex WBC 4020 and Darex WBC 833 with superior application properties, pht... -
Heraeus Electronics Unveils Advanced Die-Attach Materials for High-Reliability Power Electronics at PCIM Europe 2026
Heraeus Electronics Germany Overview Heraeus Electronics unveiled cutting-edge material technologies for power electronics at PCIM Europe 2026. New offerings include mAgic® PE340 silver pressure sintering paste for high-density packaging... -
Henkel Japan Unveils Electrically Disassemblable Adhesive and UV-Curing Insulating Coating to Boost EV Battery Repair and Recycling
ヘンケルジャパン Japan Overview Henkel Japan introduced the 'LOCTITE Easy Disassembly Adhesive (Electric Type)' for improved EV battery repair and recyclability, alongside 'LOCTITE UV-Curing Insulating Coating' for enhanced manufacturing... -
Dexerials to Showcase Advanced Functional Materials at AutoSens USA and The Battery Show Europe, Targeting Automotive and EV Markets
Dexerials Corporation Japan Overview Dexerials Corporation announced its participation in AutoSens USA 2026 (Detroit) and The Battery Show Europe (Stuttgart) in May 2026. The company will highlight its functional materials, including Ani... -
Henkel Upgrades Packaging Competence Center to Accelerate Sustainable Packaging Innovation and Circular Economy Transition
Henkel Germany Overview Henkel has modernized its Packaging Competence Center in Düsseldorf, Germany, to accelerate the development of sustainable packaging solutions. Featuring state-of-the-art laminating and coating systems developed i...
