Adhesives & Sealants– category –
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CTE-Gradient Interconnect Technology Drastically Reduces Thermal Cycling Damage in SiC Inverters
PatSnap Eureka USA Overview PatSnap Eureka reveals an innovative approach to mitigate thermal cycling damage in SiC power inverter modules by creating biomimetic interconnects with a Coefficient of Thermal Expansion (CTE) gradient. This ... -
Ziitek Technology Unveils Next-Gen Liquid Cooling Systems and Advanced Thermal Management Materials for Data Centers
Ziitek Technology China Overview Ziitek Technology announced it will showcase two decades of thermal innovation at the 2026 Global Data Center Liquid Cooling Exhibition, presenting full-stack thermal management solutions from advanced th... -
Optical Bonding: The Critical Technology Enhancing Outdoor Readability and Durability of TFT LCD Displays
CHENGHAO Display China Overview Optical bonding technology offers a crucial solution for addressing inherent industrial challenges in TFT LCD displays, including sunlight readability, durability, and moisture resistance. By filling the a... -
TANAKA to Unveil Advanced High-Conductivity Die-Attach Materials for Next-Gen Power Semiconductors at SEMICON Southeast Asia 2026
田中貴金属グループ Japan Overview TANAKA Precious Metals will showcase high-thermal-conductivity and high-reliability silver sintering pastes and AgSn TLP sheets for next-generation SiC and GaN semiconductors at SEMICON Southeast Asia 20... -
Polyurethane-Modified Acrylic Resins Achieve Dual High Adhesion and Low Dielectric for Advanced Packaging Solder Resists
ACS Applied Polymer Materials USA Overview This research from ACS Applied Polymer Materials unveils novel polyurethane-modified acrylic resins that concurrently deliver both high adhesion and low dielectric properties crucial for next-ge... -
UV-Curable Adhesives Emerge as Indispensable Solution for Invisible Bonding of Transparent Materials
Craft Resin Blog UK Overview UV-curable adhesives are gaining prominence as the optimal solution for invisibly repairing and bonding transparent materials like glass and acrylic. Unlike cyanoacrylates that cause frosting or epoxies that ... -
Direct Die-Attach Microchannel Cooling with Sintered Silver Boosts SiC Inverter Thermal Performance
PatSnap Eureka USA Overview An innovative thermal management solution combining direct die-attach microchannel cooling with sintered silver bonding is proposed to combat overheating in high-power-density SiC inverters. By directly joinin... -
Henkel Unveils Next-Gen Teroson EP 52 Series: High-Damping Structural Adhesives for Automotive Lightweighting and NVH Reduction
Henkel Germany Overview Henkel has launched the Teroson EP 52 Series, a new high-performance structural adhesive engineered for automotive manufacturing, combining superior bonding strength with advanced vibration damping capabilities. U... -
JSR Fortifies Advanced Semiconductor Material Production and R&D in Taiwan to Meet Surging AI Demand
JSR株式会社 Japan Overview JSR, a leading semiconductor materials manufacturer, announced a significant expansion of its production and R&D capabilities in Taiwan, effective April 2026. This strategic move, driven by key customer req... -
Sumitomo Chemical Develops New Ultra-Low Alpha, High-Thermal-Conductivity Alumina Filler for Advanced Semiconductors
住友化学 Japan Overview Sumitomo Chemical has developed a new 'ELA series' of high-purity alumina, boasting extremely low alpha-particle emissions and enhanced thermal conductivity, specifically for advanced semiconductors. This innovati...
