Market Trends– category –
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India’s BHEL Supplies Space-Grade Solar Panels for ISRO’s First Satellite Export Project to EADS-Astrium
BHEL India Overview Bharat Heavy Electricals Limited (BHEL) of India achieved a major milestone by manufacturing and supplying space-grade solar panels for ISRO's first satellite export project to EADS-Astrium (Europe). The satellite, eq... -
Investors Eye Teledyne Technologies’ AI-Driven Software, Radiation-Hardened Space Chips, and MEMS Expansion Strategies
Simply Wall St USA Overview Teledyne Technologies' announcement of expanded AI-driven Prism Ground ISR software, radiation-hardened space-grade semiconductors, and MEMS manufacturing capabilities has captured investor attention. The succ... -
BAE Systems’ Endura Radiation-Hardened Microchip Passes Rigorous Testing for Classified and Missile-Defense Satellites
KeepTrack Space Brief USA Overview BAE Systems' Endura computing chip has successfully passed rigorous radiation testing for classified satellite and missile-defense applications. This radiation-hardened processor significantly enhances ... -
Radiation Tolerant SerDes Chip Market for LEO Satellite Constellations Accelerates, Driven by Microchip Technology and Others
Semiconductor Insight Global Overview This article provides an overview of a market research report published by Semiconductor Insight. The market for radiation-tolerant SerDes chips in Low Earth Orbit (LEO) satellite constellations is r... -
SK Hynix to Heavily Invest in ASML EUV for HBM Production in Yongin and Cheongju, Expanding Indiana Packaging Facility
Seeking Alpha South Korea Overview SK hynix plans to extensively deploy ASML's EUV (Extreme Ultraviolet) lithography equipment at its Yongin Semiconductor Cluster and Cheongju advanced packaging facilities, significantly bolstering High-... -
China’s Memory Industry Accelerates HBM3/3E Development; YMTC Leads in Wafer-to-Wafer Hybrid Bonding Patents
BloomingBit.io China Overview China's memory industry is rapidly advancing, with companies like CXMT focusing on HBM3 and HBM3E development, thereby narrowing the technology gap with South Korea. Notably, Yangtze Memory Technologies Co. ... -
Morgan Stanley Forecasts 93% Surge in CoWoS Demand by 2027, Anticipates AMD Venice CPU Adoption
Phemex News USA Overview Morgan Stanley projects a staggering 93% surge in global demand for CoWoS (Chip-on-Wafer-on-Substrate) technology by 2027, reaching 2.694 million units. Nvidia is expected to remain the largest consumer, accounti... -
Samsung and SK hynix Reportedly Reconsidering Hybrid Bonding Timeline for HBM, 16-High HBM4E May Be Earliest Adoption
TrendForce Taiwan Overview Samsung Electronics and SK hynix are reportedly reassessing the timeline for the widespread adoption of hybrid bonding technology in High-Bandwidth Memory (HBM). While initial expectations pointed to HBM4, both... -
Micron Invests $9.3 Billion in Hiroshima for HBM Production Launching 2028, Expands Packaging Capacity in Singapore
TechsCurrent Japan Overview Micron Technology has broken ground on a $9.3 billion expansion of its Hiroshima, Japan factory to bolster High-Bandwidth Memory (HBM) production, with shipments expected around summer 2028, supported by Japan... -
HBM and ABF Shortages Intensify AI Chip Supply Bottlenecks, Ajinomoto Forecasts Over 20% ABF Supply Gap by 2027
Semiconductor Engineering USA Overview The primary bottlenecks for AI chip production are the critical shortage of High-Bandwidth Memory (HBM) and the complex packaging capacity required for GPUs/XPUs by Nvidia, AMD, and Google, coupled ...
