Market Trends– category –
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Orbital AI Data Centers Accelerate to Solve Terrestrial Power Challenges; Google Plans 2027 Satellite Learning Mission
Space Daily USA Overview To address the escalating power consumption of AI-focused data centers (equivalent to 100,000 homes), companies like Google are accelerating strategies to deploy computing infrastructure in Earth's orbit. Orbital... -
President Trump Signs National Space Transportation Policy to Support Over 1,000 Annual Launches and Re-entries by 2030
The White House USA Overview President Trump has signed a national space transportation policy aimed at supporting over 1,000 annual space launches and re-entries by 2030. This memorandum directs NASA to facilitate commercial space trans... -
Sumitomo Bakelite and Mitsubishi Chemical Raise Packaging Material Prices for CoWoS and HBM Amid Surging Demand
Global Times China Overview Increasing demand for advanced processes and packaging, coupled with rising energy and raw material costs from Middle East conflicts and China's tightened export controls on strategic minerals, is disrupting h... -
Morgan Stanley Taps Samsung Electro-Mechanics as Top Korean Tech Pick Amid Surging AI Chip Substrate Demand
Evrim Ağacı Turkey Overview Morgan Stanley has elevated Samsung Electro-Mechanics to its premier Korean tech stock, citing the escalating technical demands of AI chip designs on advanced substrates. As AI processors become larger, multi-... -
TSMC CoWoS and ABF Substrate Supply Bottlenecks Threaten AI Chip Production Amid $265B Market Opportunity
Silicon To Software USA Overview For leading AI accelerators, wafer manufacturing capacity is not the only constraint; CoWoS advanced packaging and ABF (Ajinomoto Build-up Film) substrate qualification cycles are also limiting production... -
STMicroelectronics Maintains $2 Billion Investment Amid Net Loss, Bolstering SiC, 300mm Fabs, and Advanced Packaging
Seeking Alpha Switzerland Overview Despite reporting a net loss in the first half of 2026, STMicroelectronics (STM) plans to maintain its net capital expenditure near the upper end of the $2-2.2 billion range for the year, focusing on Si... -
Semiconductor Inspection Equipment Market to Reach $13.4 Billion by 2034, KLA Leads in Advanced Packaging Process Control
Exponential Industry USA Overview The semiconductor inspection equipment market is projected to grow at a 7.9% CAGR from 2026 to 2034, reaching $13.4 billion, driven by increasing AI chip complexity and advanced packaging adoption. KLA i... -
ABF Substrate Shortages Projected Through 2028 Amid AI Boom; Taiwanese, Japanese, Korean Manufacturers Secure Orders Until 2030
digitimes Taiwan Overview The global AI computing infrastructure boom is rapidly escalating demand for GPUs, CPUs, and ASICs, leading to projected ABF (Ajinomoto Build-up Film) substrate shortages starting in 2026 and worsening through 2... -
Applied Materials Raises Advanced Packaging Revenue Forecast to Over 70% Growth on AI Demand, Unveils New HBM Systems
TrendForce USA Overview Applied Materials has significantly revised its advanced packaging revenue forecast for 2026 to over 70% year-over-year growth, a 20-percentage-point increase in just three months, driven by soaring AI semiconduct... -
PackCon 2026 to Discuss How Sustainable Packaging Drives Business Value
EuroCham Singapore Singapore Overview Scheduled for August 26, 2026, in Singapore, PackCon 2026 is an international event dedicated to exploring how sustainable packaging drives business value. Industry leaders, policymakers, sustainabil...
