New Technology– category –
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ACS Review Highlights ‘Functionalization Paradox’ in Sustainable AM, Cautioning Against Increased Carbon Footprint from Bio-Derived Materials’ Chemical Modification
ACS Publications USA Overview A new review evaluates the transition to sustainable 3D printing, specifically in vat photopolymerization, which heavily relies on petroleum-derived and non-recyclable thermosets. It identifies a 'functional... -
Comprehensive Review on Sustainable Polymer Additive Manufacturing Published by MDPI, Advocating Multi-Faceted Evaluation of Performance, Processing Burden, and Recyclability
MDPI Switzerland Overview A comprehensive review on the feasibility of sustainable polymer additive manufacturing (AM) has been published by MDPI. The review compares three primary AM pathways—SLA, DLP, and FDM—highlighting challenges in... -
Novel Hyperbranched Polyphenylsiloxane-Modified Epoxy Resin Achieves Dielectric Constant of 2.82 and Dissipation Factor of 0.02050 at 100 MHz for Electronic Packaging
ACS Publications USA Overview A new facile method has been reported for constructing hyperbranched polyphenylsiloxane (HBPSi)-modified epoxy resins with excellent low dielectric properties for electronic packaging. The developed DGEBA/HB... -
Sumitomo Chemical and Gutenberg Co-Develop Liquid Crystal Polymer Filament for 3D Printing in Semiconductor and AI Applications
Plastics Today Japan Overview Sumitomo Chemical and Gutenberg Co. in Tokyo have successfully co-developed a liquid crystal polymer (LCP) filament specifically for 3D printing applications in semiconductors, AI, and next-generation mobili... -
INTAMSYS and JLC3DP Launch Scalable PEEK and PEKK 3D Printing Services for Aerospace and Semiconductor Applications
INTAMSYS / JLC3DP China Overview INTAMSYS and JLC3DP have introduced scalable 3D printing services for PEEK and PEKK, targeting high-demand engineering sectors such as aerospace, semiconductors, energy, automotive, and robotics. Supporte... -
Bilby3D Unveils High-Temperature 3D Printing Filaments, Including ThermaX PEEK/TPI, for Aerospace and Automotive Sector Operating Above 120°C
Bilby3D Australia Overview Bilby3D has introduced a new line of high-temperature 3D printing filaments, featuring advanced polymers like ThermaX TPI (Thermoplastic Polyimide) and ThermaX PEEK. These materials are engineered to withstand ... -
Consortium Demonstrates Robust Quantum Encryption Over 254km Existing Fiber, Integrating QKD and Next-Gen Schemes on Commercial Network
Physics Today (via Facebook) USA Overview A collaboration of three companies has successfully demonstrated robust quantum encryption over a record-breaking 254 kilometers of existing telecom fiber, while maintaining regular commercial ne... -
IBM Ventures Leads $8 Million Investment in BQP to Commercialize BQPhy Quantum-Accelerated Physics Simulation Platform
Quantum Computing Report USA Overview IBM Ventures led an $8 million investment in BQP, an enterprise software developer, to advance its BQPhy platform for quantum-accelerated physics simulation. This funding supports the commercial depl... -
IonQ Unveils Superion 256 Quantum Computing Platform, Targeting Fault-Tolerant Computing with 256 Qubits, Customer Deliveries Planned for 2027
IonQ USA Overview IonQ has debuted its sixth-generation quantum computing platform, IonQ Superion 256, engineered for manufacturable fault-tolerant quantum computing. The company has successfully fabricated its first fully integrated 256... -
Quantum Error Correction Advancements Propel Codebreaking Quantum Computers: Breakthroughs in LDPC Codes and Neutral Atom Architectures
EurekAlert! USA Overview Advances in quantum error correction (QEC) are accelerating the development of Cryptographically Relevant Quantum Computers (CRQCs). A Caltech paper proposes a neutral atom-based QC architecture with qLDPC-based ...
