New Technology– category –
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Lessengers 3.2T NPO: Glass substrate AI switch power specs
Lightwave USA Overview Lessengers has introduced a 3.2T glass substrate Near-Packaged Optics (NPO) platform for AI and HPC fabrics, delivering 3.2 Tbps per optical engine. This innovative Direct Optical Wiring (DOW) technology significan... -
FIBERSTAMP 1.6T OSFP224: 18W hybrid transceiver specs
Lightwave Online (FIBERSTAMP) Singapore Overview FIBERSTAMP launched its HYBRID 1.6T OSFP224-HRO 2×DR4 heterogeneous silicon photonics transceiver, achieving a maximum module power of 18W. This low power consumption is enabled by a propr... -
Marvell: 2nm silicon photonics 3.2Tbps specs for ECOC 2026
remio AI USA Overview Marvell announced a demonstration at ECOC 2026 of groundbreaking 400 gigabits/lane PAM4 and 3.2 terabit optical modules, built on its industry-leading 2nm silicon photonics technology. The company has already proven... -
Intel MicroLEDs: 10-meter optical interconnects for AI
Tom's Hardware USA Overview Intel has secured a U.S. patent for embedding MicroLEDs directly into chip packages. This innovative design facilitates optical signal transmission by integrating MicroLED-equipped semiconductor dies into a gl... -
Canon and NTT: Real-time remote sports viewing via IOWN APN
Canon Japan Overview Canon, in collaboration with NTT's IOWN All-Photonics Network (APN), successfully conducted the world's first real-time remote sports viewing demonstration by integrating its volumetric video technology and MREAL mix... -
Co-Packaged Optics explained: 400 Tbps data center capacity
AZoOptics Unknown Overview Co-packaged optics (CPO) is an emerging technology addressing energy challenges in data centers by integrating photonics directly with processors, enhancing performance and efficiency. Broadcom's 51.2-Tb Bailly... -
Yale University Nd Laser: Chip-scale MOPA system specs
Photonic Integrated Circuits News (PIC Magazine) USA Overview Researchers at Yale University have developed a chip-scale Neodymium-doped Yttrium Aluminum Garnet (Nd) laser amplifier system using a master oscillator power amplifier (MOPA)... -
Quantum Computing Inc: TFLN photonics for EQC optimization
Quantum Computing Inc. / Medium USA Overview Quantum Computing Inc. (QUBT) has developed compact, high-speed optical processors utilizing thin-film lithium niobate chips, specifically enhancing its Entropy Quantum Computer (EQC) for comp... -
BizLink & ams OSRAM: AI data center optical link technology
BizLink Germany Overview BizLink and ams OSRAM have announced a strategic partnership to co-develop next-generation optical interconnect solutions for AI scale-up domains. They plan to demonstrate their innovative low-power, low-latency ... -
Q.ANT SDK: Open-source photonic computing NPU programming
Markets Insider / Q.ANT Germany Overview Q.ANT has unveiled the world's first open-source Software Development Kit (SDK) for photonic computing, empowering developers to program the core operations of photonic processors. Q.ANT commercia...
