New Technology– category –
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Intel CPO: InP on Silicon integrated laser roadmap
The Intellionaire USA Overview Intel is distinguishing itself in the Co-Packaged Optics (CPO) market as the sole company to design and manufacture its own integrated InP on Silicon lasers. Its Optical Compute Interconnect (OCI) solution ... -
NVIDIA Optical I/O: 256 Gb/s DWDM silicon photonics specs
Simple Tech Trend USA Overview At OFC 2026, NVIDIA announced a 256 Gb/s DWDM optical I/O, achieved through the intimate 3D stacked packaging of Electronic ICs (EIC) and Photonic ICs (PIC), delivering an ultra-low power consumption of 2.6... -
Intel OCI Chiplet: AI infrastructure power specs for 2026
Simple Tech Trend USA Overview At OFC 2026, Intel introduced its Optical Compute Interconnect (OCI) chiplet, deemed essential for AI scale-up infrastructure. This OCI chiplet demonstrates remarkable energy efficiency of approximately 5 p... -
Broadcom Bailly Switch: 51.2Tb CPO power reduction specs
Simple Tech Trend USA Overview Broadcom has commenced mass production of its 51.2 Terabit (Tb) Bailly switch, achieving up to 70% power consumption reduction through Co-Packaged Optics (CPO) compared to traditional pluggable transceivers... -
Frequency Combs: Optica’s 2026 AI optical I/O roadmap
Optica USA Overview Alexander Gaeta's article in Optica details groundbreaking advancements in commercializing frequency combs for integrated photonics. This technology allows for the generation of low-power, compact microcombs compatibl... -
Tomahawk 6: Fuji’s first SMT placement of Broadcom CPO
Davisson (Fuji Corporation Press Release) Japan Overview Fuji Corporation has successfully performed the industry's first SMT placement evaluation of Broadcom's Tomahawk® 6 – Davisson Co-Packaged Optics (CPO) Ethernet switch. Utilizing t... -
OFC 2026: Broadcom and Coherent photonic interconnect specs
Simple Tech Trend (OFC Panel Report) USA Overview An OFC 2026 panel highlighted the critical challenge of ultra-low-power photonic scale-up interconnects for AI clusters, showcasing diverse technological approaches. Broadcom demonstrated... -
Lightmatter: Passage and Guide specs for 300mm silicon wafers
The Diligence Stack USA Overview Lightmatter CEO Nick Harris outlined the company's strategy to resolve computing's interconnect bottleneck using its Passage™ and Guide™ products, which establish optical links from near-packaged optics (... -
Quandela: III-V quantum dot devices and 2026 scaling roadmap
Quandela France Overview Quandela highlights research demonstrating that foundry-compatible III–V quantum-dot devices can provide the core light–matter capabilities for scalable hybrid photonic quantum computing. This work signifies a sh... -
Optica Kerr Frequency Microcombs: GPU/CPU CPO roadmap
Optica Publishing Group / OPN (Optics & Photonics News) USA Overview Optica's VP Alexander Gaeta unveiled a significant breakthrough in the commercialization of milliwatt-power, compact, and robust Kerr frequency microcombs. This technol...
