New Technology– category –
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S15611W explained: Hamamatsu Photonics CMOS sensor specs
Optics.org Japan Overview Hamamatsu Photonics has announced the S15611W, a new CMOS linear image sensor with an integrated timing generator, bias generator, and 12-bit A/D converter, providing direct digital output. This sensor features ... -
Nokia: 800ZR/ZR+ 3nm DSP pluggable optics for subsea networks
Nokia (Optical network blogs) Finland Overview Nokia reports that coherent pluggable optics, traditionally used in terrestrial networks, are now extending their applicability to subsea networks. This shift is driven by advancements in 80... -
SiCN and SiN deposition: High-speed PIC transmission explained
EurekAlert! United States Overview Significant advancements in silicon carbon nitride (SiCN) and silicon nitride (SiN) deposition and manipulation techniques have dramatically improved the fabrication and functionality of photonic integr... -
Coherent: 3.2T and 6.4T optical solutions for AI at ECOC 2026
Coherent (via Stock Titan) USA Overview Coherent will showcase advanced optical solutions at ECOC 2026 to dramatically scale AI infrastructure, including a compact 3.2T pluggable architecture with dual 1.6T optical paths in an OSFP-size ... -
AIM Photonics Showcases Integrated Photonics for Diverse Military Applications at Pentagon Event, Featuring Albany NanoTech Silicon Photonic Sensors
Quantum Zeitgeist USA Overview AIM Photonics demonstrated integrated photonics technologies for various military applications at the U.S. Department of Defense's Manufacturing Technology (ManTech) program's 70th-anniversary event. Key am... -
Tyndall Researchers Unveil Advanced Photonic Packaging Innovations at ESTC 2026, Including Co-Packaged Bioimaging and Cryogenic Edge Coupling
Tyndall National Institute Ireland Overview Researchers from the Tyndall National Institute presented three papers at the European Semiconductor Technology Conference (ESTC) 2026, showcasing significant advancements in photonic packaging... -
TSMC Accelerates Co-Packaged Optics (CPO) Deployment, Eyes ‘CPO Moore’s Law’ for AI Chip Performance Boost
KuCoin Taiwan Overview As GPU and ASIC computing power continues to advance, TSMC is accelerating the deployment of Co-Packaged Optics (CPO) to address the power consumption and signal transmission limits of traditional copper interconne... -
ASML and Xanadu Partner to Reduce Optical Losses in Photonic Quantum Chips via Advanced Lithography
Bits&Chips Netherlands Overview ASML and Canadian quantum computing firm Xanadu have announced a collaboration to enhance the manufacturing of photonic quantum processors using advanced lithography techniques. This partnership aims to re... -
Celero Communications Secures $275 Million for 1.6T/3.2T AI Optical Interconnects After Verifying 2nm Coherent DSP Silicon
Semiconductor Engineering USA Overview Celero Communications has raised $275 million for next-generation 1.6T to 3.2T AI optical interconnects, following successful verification of its 2nm coherent DSP silicon. This substantial funding h... -
Thin-Film Barium Titanate Emerges as Promising Material for High-Speed, Low-Loss Integrated Photonic Devices
Unknown Unknown Overview Thin-film barium titanate (BTO) shows significant promise as an electro-optic (EO) material for high-speed, low-loss integrated photonic devices, offering wider bandwidth and negligible optical loss compared to s...
