Polymers & Resins– category –
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JLC3DP Specifies PLA Heat Resistance Limit at 55-65°C, Recommends PETG, ABS, PEEK for Applications Above 50-60°C
JLC3DP China Overview JLC3DP has released a detailed guide on the heat resistance of PLA (Polylactic Acid) in 3D printing, clarifying that its rigidity typically begins to degrade around 55-65°C. Despite a melting point of 150-180°C, thi... -
3DCeram Endorses Vat Photopolymerization (Ceramic SLA) for Manufacturing Advanced Ceramic Parts with Complex Geometries and Fine Details
3DCeram France Overview French company 3DCeram promotes Vat Photopolymerization, or ceramic SLA, as a leading additive manufacturing process for producing advanced ceramic parts with complex geometries and fine details. This technology s... -
YD Rapid Details Superiority of Polyimide (PI) Material for CNC Machining: High-Temperature Resistance and Diverse Mechanical/Electrical Properties for Demanding Applications
YD Rapid China Overview YD Rapid has highlighted the advantages of Polyimide (PI) material as a high-performance engineering polymer for CNC machining, specifically designed for challenging applications requiring high-temperature resista... -
Master Bond Offers Low-Stress, Low-Outgassing, Fast-Curing Glob Top Epoxy Compounds for Semiconductor Chip and Wire Bond Protection
Master Bond Inc. USA Overview Master Bond is supplying high-performance glob top epoxy compounds for the encapsulation of semiconductor chips and wire bonds in chip-on-board (COB) applications. These formulations provide effective protec... -
Master Bond Announces EP30LTE-2, a Two-Part Epoxy System Achieving Ultra-Low CTE (10-13 x 10^-6 in/in/°C) and High Dimensional Stability for Aerospace, Optical, and Electronic Industries
Master Bond Inc. USA Overview Master Bond has launched EP30LTE-2, a groundbreaking two-part epoxy system characterized by an exceptionally low coefficient of thermal expansion (CTE) of 10-13 x 10^-6 in/in/°C, coupled with outstanding dim... -
Master Bond Offers Heat-Curable and Biocompatible Epoxy Adhesive Systems Optimized for Polyimide Bonding in Semiconductor, Aerospace, and Medical Devices
Master Bond Inc. USA Overview Master Bond provides high-performance epoxy adhesive systems specifically engineered for bonding polyimide plastics to themselves and to dissimilar substrates, leveraging polyimide's superior thermal stabili... -
Royal Society of Chemistry Unveils In-Situ Additive Manufacturing Platform for Embedded Multifunctional Laser-Induced Graphene in PEEK
Materials Horizons (Royal Society of Chemistry) UK Overview Research published in Materials Horizons by the Royal Society of Chemistry presents an innovative platform enabling in-situ additive manufacturing of multifunctional laser-induc... -
Master Bond Unveils Dimensionally Stable Epoxy Adhesive Systems Achieving Low Shrinkage and Ultra-Low CTE for Semiconductor and Optoelectronic Packaging
Master Bond Inc. USA Overview Master Bond has introduced dimensionally stable epoxy adhesive systems specifically engineered for semiconductor assembly, optoelectronic packaging, and high-voltage sensor potting applications. These system... -
H-O Products Offers High-Performance Polyimide and PEEK Films for Industrial Applications, Withstanding Temperatures from -269°C to Over +240°C
H-O Products USA Overview H-O Products is supplying high-performance films, papers, and laminates, including polyimide films and Victrex APTIV® PEEK films, engineered for extreme temperature resilience from -269°C to +240°C (and up to +4... -
INCURE INC. Carbon Fiber High-Temperature Resin Selection Guide Details Thermal Performance of Epoxies, Polyimides, and Post-Curing Criticality
INCURE INC. USA Overview INCURE INC. has released a selection guide for high-temperature resins used in carbon fiber composites, emphasizing that the resin matrix is the primary determinant of a laminate's heat resistance. The guide comp...
