Polymers & Resins– category –
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YD Rapid Details Superiority of Polyimide (PI) Material for CNC Machining: High-Temperature Resistance and Diverse Mechanical/Electrical Properties for Demanding Applications
YD Rapid China Overview YD Rapid has highlighted the advantages of Polyimide (PI) material as a high-performance engineering polymer for CNC machining, specifically designed for challenging applications requiring high-temperature resista... -
Master Bond Offers Low-Stress, Low-Outgassing, Fast-Curing Glob Top Epoxy Compounds for Semiconductor Chip and Wire Bond Protection
Master Bond Inc. USA Overview Master Bond is supplying high-performance glob top epoxy compounds for the encapsulation of semiconductor chips and wire bonds in chip-on-board (COB) applications. These formulations provide effective protec... -
Master Bond Announces EP30LTE-2, a Two-Part Epoxy System Achieving Ultra-Low CTE (10-13 x 10^-6 in/in/°C) and High Dimensional Stability for Aerospace, Optical, and Electronic Industries
Master Bond Inc. USA Overview Master Bond has launched EP30LTE-2, a groundbreaking two-part epoxy system characterized by an exceptionally low coefficient of thermal expansion (CTE) of 10-13 x 10^-6 in/in/°C, coupled with outstanding dim... -
Master Bond Offers Heat-Curable and Biocompatible Epoxy Adhesive Systems Optimized for Polyimide Bonding in Semiconductor, Aerospace, and Medical Devices
Master Bond Inc. USA Overview Master Bond provides high-performance epoxy adhesive systems specifically engineered for bonding polyimide plastics to themselves and to dissimilar substrates, leveraging polyimide's superior thermal stabili... -
Royal Society of Chemistry Unveils In-Situ Additive Manufacturing Platform for Embedded Multifunctional Laser-Induced Graphene in PEEK
Materials Horizons (Royal Society of Chemistry) UK Overview Research published in Materials Horizons by the Royal Society of Chemistry presents an innovative platform enabling in-situ additive manufacturing of multifunctional laser-induc... -
Master Bond Unveils Dimensionally Stable Epoxy Adhesive Systems Achieving Low Shrinkage and Ultra-Low CTE for Semiconductor and Optoelectronic Packaging
Master Bond Inc. USA Overview Master Bond has introduced dimensionally stable epoxy adhesive systems specifically engineered for semiconductor assembly, optoelectronic packaging, and high-voltage sensor potting applications. These system... -
H-O Products Offers High-Performance Polyimide and PEEK Films for Industrial Applications, Withstanding Temperatures from -269°C to Over +240°C
H-O Products USA Overview H-O Products is supplying high-performance films, papers, and laminates, including polyimide films and Victrex APTIV® PEEK films, engineered for extreme temperature resilience from -269°C to +240°C (and up to +4... -
INCURE INC. Carbon Fiber High-Temperature Resin Selection Guide Details Thermal Performance of Epoxies, Polyimides, and Post-Curing Criticality
INCURE INC. USA Overview INCURE INC. has released a selection guide for high-temperature resins used in carbon fiber composites, emphasizing that the resin matrix is the primary determinant of a laminate's heat resistance. The guide comp... -
INCURE INC. Highlights Superior Precision and Detail of UV Resins for 3D Printing, Enabling Applications from Master Patterns to Optical Components
INCURE INC. USA Overview INCURE INC. has released an article emphasizing the superior precision and detail capabilities of UV resins in 3D printing, positioning them as ideal for applications requiring high surface quality and fine featu... -
Empa and Elantas Engineer Recyclable, Flame-Retardant Epoxy Composites for Sustainable Aerospace and Rail
MaterialDistrict Switzerland Overview Researchers at Empa, in collaboration with specialty chemical company Elantas, have developed a pioneering flame-retardant and recyclable epoxy system for composite materials. This innovation, incorp...
