Semiconductor Back-End– category –
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Intel Appoints Former SK hynix CEO Lee Seok-hee as Senior VP of Advanced Packaging to Bolster AI Systems
The Korea Herald South Korea Overview Intel has appointed Lee Seok-hee, former CEO of SK hynix and SK On, as Senior Vice President of Intel Foundry. Lee will lead advanced packaging, system integration, back-end technology development, a... -
Amkor Supercharges U.S. Chip Packaging with 67-Acre Arizona Expansion, Aiming for First High-Volume Advanced OSAT
StocksToTrade USA Overview Amkor Technology has significantly expanded its U.S. presence by acquiring an additional 67 acres at its advanced packaging and test campus in Peoria, Arizona. This strategic move targets establishing the natio... -
AT&S Commits €2 Billion to Accelerate AI/HPC Chip Substrate Production in Asia, Bolstered by AMD Partnership
TNW オーストリア Overview Austrian IC substrate manufacturer AT&S is investing €1.5-2 billion to significantly expand high-end IC substrate capacity at its Kulim, Malaysia, and Chongqing, China, facilities. This strategic move, drive... -
TSMC and Amkor Forge 10-Year Strategic Partnership to Boost U.S. Advanced Packaging Capabilities
Focus Taiwan Taiwan Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to bolster advanced semiconductor packaging in the United States. Under this pact, TSMC will procure advanced packaging and test services f... -
Kaynes Technology Partners with Japan’s AOI Electronics to Build ₹3,307 Cr OSAT Plant in India, Boosting Semiconductor Back-End Capabilities
Sahi India Overview Kaynes Technology's subsidiary has formally partnered with Japanese OSAT leader AOI Electronics for a ₹3,307 crore (approx. $395 million USD) Sanand OSAT facility, slated for commercial operation in H2 2026. This coll... -
Micron’s HBM Capacity Sold Out Through 2026, Securing Position in NVIDIA’s Next-Gen AI Platform “Vera Rubin”
Investing.com USA Overview Micron Technology has announced that its high-bandwidth memory (HBM) production capacity is completely sold out through 2026, with long-term contracts secured, reflecting overwhelming demand for AI-driven HBM. ... -
SK Hynix Holds U.S. Talks on HBM Supply and Investment Plans, Bolstering Domestic Semiconductor Supply Chain
digitimes Taiwan Overview SK Hynix reportedly held private discussions with U.S. Deputy Assistant Secretary Alison Hooker regarding high-bandwidth memory (HBM) supply to key U.S. tech firms and potential semiconductor investment plans in... -
SK Hynix Begins Shipping 12-Layer Next-Gen ‘HBM4E’ Samples for AI, Delivering Significant Performance and Power Efficiency Gains Amidst NVIDIA CEO’s Endorsement
SK hynix Inc. South Korea Overview SK Hynix has commenced shipping samples of its 12-layer 'HBM4E,' a next-generation DRAM for AI, to key customers. This HBM4E features data processing speeds of up to 16Gbps per pin and over 20% improved... -
Lam Research Forecasts Over 50% Growth in Advanced Packaging Revenue by 2026, Emerging as a Key AI “Picks and Shovels” Provider
XTB.com USA Overview Lam Research, a leading semiconductor equipment manufacturer, predicts over 50% growth in its advanced packaging related revenue by 2026, driven by soaring demand for AI accelerators, HBM, and chiplet-based architect... -
Samsung’s Advanced Packaging Lag Clouds AI Chip Comeback, Falling Behind TSMC and Intel
digitimes Taiwan Overview Despite efforts in HBM and foundry services, Samsung Electronics' lagging advanced packaging capabilities remain a significant weakness in the AI chip supply chain. Industry sources and Korean media reports indi...
