Semiconductor Back-End– category –
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ASE Technology Holding Raises 2026 Capex to $8.5 Billion Driven by Surging AI Advanced Packaging Demand, Launches 15 Expansion Projects in Taiwan & Malaysia
SemiMedia Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, has significantly increased its 2026 capital expenditure plan from $7 billion to $8.5 billion, a 21.4% jump, driven by robust demand from AI servers, HP... -
TSMC Boosts CoWoS Capacity, Reducing AI Chip Supply Gap to 10% by Late 2026; Next-Gen CoPoS Pilot Production for NVIDIA’s ‘Feynman’ Slated for 2027
Futuretech Components / Daily Beirut Taiwan Overview TSMC is rapidly expanding its CoWoS advanced packaging capacity to meet surging demand from AI accelerators and HPC applications, projected to narrow the supply-demand gap from 20% to ... -
Applied Materials Unveils New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc. USA Overview Applied Materials has introduced a suite of new material engineering systems designed to accelerate the manufacturing of advanced 3D chip architectures crucial for next-generation AI. These innovation... -
Semiconductor Back-End Weekly Report May 20, 2026
▼ ▼ ▼ If you found the infographic compelling and want to read the full Weekly Report, click below to download the Strategy Report. ▼ ▼ ▼ 📄 Semiconductor Back-End Weekly Report — June 20, 2026 Semiconductor_BackEnd_WeeklyReport_EN_20260... -
imec Breaks New Ground: III-V Chiplets on RF Silicon Interposer Achieve 100x Capacitance Density Boost and Sub-600nm Precision
OriginBrief ベルギー Overview imec has announced a significant breakthrough in heterogeneous integration, successfully integrating III-V chiplets onto a 300mm RF silicon interposer platform. This achievement delivers a 10-100x increase i... -
Amkor Technology Shifts SiP Production to Vietnam to Enhance High-Value Programs, Driven by Strong Demand for Advanced Packaging in Premium Smartphones
TradingView USA Overview Amkor Technology continues to benefit from robust demand for advanced packaging solutions like flip-chip and System-in-Package (SiP), fueled by increased semiconductor content in premium smartphones. The company ... -
Nokia Announces Major Expansion of U.S. Advanced Semiconductor Test and Packaging Operations in Pennsylvania, Doubling Workforce to Over 500, to Bolster AI Infrastructure
GlobeNewswire USA Overview Nokia has unveiled a major expansion of its Advanced Test and Packaging (ATP) operations in Allentown, Pennsylvania. This investment aims to enhance domestic production capacity for optical networking technolog... -
TSMC Accelerates CoPoS Packaging Development, Standardizing 310x310mm Panel Format; Introduces Glass Core Substrate for CoWoS Towards Late 2028 Mass Production
TrendForce Taiwan Overview TSMC is accelerating the development of its CoPoS (Chip-on-Panel-on-Substrate) packaging architecture, standardizing a 310x310mm panel format, with pilot production targeted for 2027 and mass production in late... -
SK hynix Begins Shipping Next-Gen HBM4E AI Memory Chips with 12-Layer Stack, 48GB Capacity, 16Gbps per Pin, and Over 20% Power Efficiency Boost
Bisinfotech South Korea Overview SK hynix has commenced shipments of its next-generation HBM4E AI memory chips, featuring a 12-layer stack with 48GB capacity, ultra-fast data transfer rates of up to 16Gbps per pin, and over 20% improved ... -
Samsung Considers New HBM-Focused Advanced Semiconductor Packaging Plant in South Korea’s Honam Region to Meet AI Server Demand
SamMobile South Korea Overview Samsung Electronics is exploring the construction of a new advanced semiconductor packaging facility in South Korea's Honam region, with Gwangju emerging as a prime candidate. This project aims to bolster S...
