Semiconductor Back-End– category –
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OSAT Vendors Report Strong Q1 2026 Revenue Growth Driven by AI-Related Advanced Packaging Demand: ASE Up 18%, Amkor Up 25%
Counterpoint Research Global Overview The Outsourced Semiconductor Assembly and Test (OSAT) sector recorded robust revenue growth in Q1 2026, fueled by surging AI-driven advanced packaging demand. ASE Technology Holding reported an 18% y... -
TSMC and Amkor Technology Forge 10-Year Strategic Partnership to Expand Advanced Chip Packaging Capabilities in the US
Focus Taiwan USA Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to significantly bolster advanced semiconductor packaging and test capacity in the United States. This partnership aims to expand advanced pac... -
SK hynix Ships 12-Layer HBM4E Samples with Advanced MR-MUF Packaging, Achieving Over 20% Power Efficiency and 17% Thermal Resistance Improvement Over HBM4
Advanced Packaging News South Korea Overview SK hynix announced the sampling of its 12-layer HBM4E memory for next-generation AI systems, leveraging proprietary Advanced MR-MUF packaging. This innovation delivers 48GB capacity per stack ... -
Singapore’s Exports Soar to 22-Year High in May 2026, Driven by AI Semiconductor Supply Chain Contributions from Micron’s HBM Packaging and UMC’s 22nm Production
FSMOne Singapore Overview Singapore's non-oil domestic exports (NODX) recorded their highest growth in 22 years in May 2026, primarily due to the nation's deep integration into the AI semiconductor supply chain. Micron Technology's HBM a... -
ASE Technology Holding Accelerates AI Chip Production with Major Packaging Expansion, Raises 2026 LEAP Revenue Target to Over $3.5 Billion
Crypto Briefing Taiwan Overview ASE Technology Holding is embarking on a significant global expansion, including 15 new facilities, to address the escalating demand for AI chips. This strategic move, leveraging their LEAP platform and VI... -
Semiconductor Startup Funding Diversifies Beyond AI Accelerators to Interconnects and Packaging; TSMC CoWoS Capacity to Quadruple by EOY 2026
New Market Pitch Global Overview Semiconductor startups attracted $8.4 billion in Q1 2026, pushing cumulative funding to $10.7 billion, with investments diversifying beyond AI accelerators to interconnects, optical I/O, memory, and advan... -
Hanmi Semiconductor Secures ₩44.2 Billion SK hynix Order for HBM4 TC Bonders, Signaling Robust Advanced Packaging Equipment Market Growth
HTX South Korea Overview Hanmi Semiconductor has received a significant ₩44.2 billion (approx. $32 million) order from SK hynix for its TC Bonder 4.5 Griffin, crucial for next-generation HBM4 production, with delivery slated for early Se... -
ASML, TSMC, and Imec Achieve Breakthrough 300mm Integration for Industry-Ready 2D-Material Transistors
The cleanroom Portal - Reinraum Online Germany Overview Imec, in collaboration with ASML and TSMC, presented a robust and scalable 300mm integration approach for n- and p-FETs based on 2D materials at the IEEE/JSAP Symposium 2026. This b... -
Imec’s Chiplet Imperative: Analyzing the Transition to High-Bandwidth, Low-Energy AI/HPC Systems
imec ベルギー Overview Imec has published a comprehensive analysis identifying the economic and technical inflection points for transitioning from monolithic ASICs to chiplet-based designs, particularly for AI, HPC, and data center appli... -
Morgan Stanley Raises CoWoS Demand Forecast to 2.69 Million Wafers by 2027, Citing CPUs and ASICs as New Drivers
Industry Analysis / Moomoo Unknown Overview Morgan Stanley has significantly raised its demand forecast for TSMC's CoWoS packaging, projecting it to reach 2.69 million wafers annually by 2027. CPUs and ASICs are emerging as new key drive...
