Semiconductor Back-End– category –
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Imec Unveils Vertically Stacked IGZO FeFETs, Revolutionizing AI Memory Density and Efficiency
IN Electronics & Design ベルギー Overview Imec has achieved a significant breakthrough in ferroelectric memory for AI systems, demonstrating a vertically stacked FeFET architecture utilizing IGZO and successfully reducing ferroelectric c... -
Imec Targets Optical Interconnect Packaging Bottlenecks for Next-Gen AI and HPC
ApplyKite (imec) ベルギー Overview Imec is seeking a PhD candidate for groundbreaking research into microfluidics and photonics packaging, crucial for optical interconnects in future AI and High-Performance Computing (HPC) systems. The p... -
Resonac to Initiate High-Purity HF Gas Production at Tokuyama Plant by 2026, Strengthening Domestic Semiconductor Supply
Resonac (Official Press Release) / IBTimes JP Japan Overview Resonac announced it will begin producing high-purity hydrogen fluoride (HF) gas for semiconductors at its Tokuyama plant in Shunan City, Yamaguchi Prefecture, within 2026. Thi... -
TSMC Accelerates CoPoS Packaging with Glass Core Substrates: Targets 30% Cost Reduction, >90% Wafer Utilization Post-2028
Wccftech / CHOSUNBIZ / BigGo Finance Taiwan Overview TSMC is accelerating the development of CoPoS packaging, a successor to CoWoS, leveraging glass core substrates co-developed with Ibiden and Innolux. This panel-level packaging approac... -
Samsung and SK Hynix Announce Major HBM Capacity Expansions: Samsung Allocates Half to HBM4, Targeting 250K Wafers/Month by EOY 2026
Industry News / ChosunBiz South Korea Overview Samsung Electronics announced plans to increase its HBM production capacity by approximately 50% from 2025 levels, aiming for 250,000 semiconductor wafers per month by the end of 2026. The c... -
TSMC’s CoWoS Packaging Capacity Identified as Bottleneck in Korea’s HBM4E Race, Despite SK hynix and Samsung Shipments
Aju Press South Korea Overview Despite SK hynix and Samsung Electronics commencing sample shipments of 12-layer HBM4E chips to major customers like Nvidia, TSMC's CoWoS advanced packaging capacity is highlighted as the true bottleneck in... -
Samsung Validates Hybrid Copper Bonding’s Superior Thermal Management for HBM4E, Outperforming TCB
ET News (via IEEE paper) South Korea Overview Samsung published research in IEEE demonstrating that its Hybrid Copper Bonding (HCB) offers significant thermal management advantages over conventional Thermo-Compression Bonding (TCB) for H... -
ATLANT 3D, A*STAR IMRE, and NAMIC Launch AI-Driven Materials Development Hub in Singapore
PR Newswire Singapore Overview ATLANT 3D, A*STAR IMRE, and NAMIC have signed an MoU to establish an Advanced Materials Development Hub (A-HUB) in Singapore, leveraging ATLANT 3D's Direct Atomic Layer Processing (DALP®) technology. This c... -
Malaysia Invests RM185 Million ($40M) in Advanced Semiconductor R&D Initiative, Targeting 7% Global Packaging Market Share with HBM4 Test Chip Development
Malay Mail / Digital News Asia Malaysia Overview Malaysia's Ministry of Science, Technology and Innovation (Mosti) has launched a RM185 million (approx. $40 million USD) Research, Development, Innovation, Commercialization, and Economy (... -
Morgan Stanley: TSMC AI Revenue to Triple by 2027, CoWoS Packaging Remains Critical Bottleneck
HTX Insights (Morgan Stanleyレポート引用) International Overview A new report from Morgan Stanley forecasts TSMC's AI-related revenue to surge by 218% to $86.3 billion by 2027, up from $27.1 billion in 2026. However, this explosive growt...
