Semiconductor Back-End– category –
-
TSMC Accelerates CoWoS and SoIC Expansion to Quell AI Chip Bottleneck, Targets 4x Capacity by 2026
FinancialContent - Stock Market Taiwan Overview TSMC is aggressively expanding its CoWoS and SoIC advanced packaging capacity to address the soaring demand for AI chips, aiming to increase monthly wafer output from approximately 35,000 u... -
EV Group Unlocks Next-Gen Semiconductor Performance with Advanced Integration Technologies at ECTC 2026
EV Group オーストリア Overview At ECTC 2026, EV Group showcased its latest advancements in hybrid bonding, layer transfer, and maskless lithography, offering crucial solutions for next-generation heterogeneous integration and advanced pa... -
Amkor Technology Secures CHIPS Act Funding, Expands U.S. Advanced Packaging Footprint in Arizona
Amkor Technology (via Business Wire) USA Overview Amkor Technology is significantly boosting its U.S. advanced packaging and test capabilities by acquiring an additional 67 acres adjacent to its existing 104-acre campus in Peoria, Arizon... -
Semiconductor Back-End Weekly Report May 18, 2026
📄 Weekly Report May 18, 2026 (PDF) — Download Weekly Report May 18, 2026 (PDF) — DownloadDownload 🎙 Podcast May 17, 2026 (MP3) — Play & Download Semiconductor_BackEndEnglishPodcast_20260517_sample.mp3Download View Past Weekly Reports→ -
Samsung Electro-Mechanics and Sumitomo Chemical Group Partner to Establish Glass Core Substrate Joint Venture
企業発表 South Korea Overview Samsung Electro-Mechanics and Sumitomo Chemical Group have signed an MOU to establish a joint venture for manufacturing "glass core" substrates, a critical material for next-generation advanced packaging. Ai... -
SK Hynix Validates 12-Die Hybrid Bonded HBM Stack Amidst Heated AI Memory Race
専門メディア South Korea Overview SK Hynix has successfully verified a 12-die HBM stack using hybrid bonding, demonstrating significant progress in its next-generation packaging technology for HBM4 and HBM5. While actively improving yiel... -
Samsung Electronics Pioneers HBM4 Mass Production with Hybrid Bonding, Solidifying Market Lead
専門メディア South Korea Overview Samsung Electronics is strategically deploying dedicated hybrid bonding lines in its domestic facilities for HBM4, aiming to secure market leadership. The company has successfully commenced mass producti... -
SK Hynix Initiates HBM Packaging Hub Construction in Cheongju to Bolster AI Memory Capacity
専門メディア South Korea Overview SK Hynix has broken ground on a substantial advanced packaging facility in Cheongju Technopolis, signaling a strategic shift in AI semiconductor competition from wafer fabrication to performance-critical... -
Hanmi Semiconductor Unveils Second-Gen Hybrid Bonder for Advanced HBM Stacking, Investing $67M in New Factory
専門メディア South Korea Overview Hanmi Semiconductor is set to introduce its second-generation hybrid bonder prototype this year, crucial for next-generation HBM mass production with over 20 stacked layers. Concurrently, the company is ... -
ABF Substrate Becomes Critical Bottleneck in AI Hardware Supply Chain, Driven by Ajinomoto’s Dominance
専門メディア (分析) Taiwan Overview Ajinomoto Build-up Film (ABF), an essential insulating dielectric for high-performance substrates, has emerged as an unexpected bottleneck in the AI hardware ecosystem due to Ajinomoto Fine-Techno's ne...
