Space Industry– category –
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DARPA Selects Seven Projects for ‘Rads to Watts’ Program to Develop Radioisotope Power for Deep-Sea and Space Environments
American Nuclear Society USA Overview DARPA has selected seven innovative projects for its 'Rads to Watts' program, focused on designing radioisotope voltaic cells to provide long-term power in extreme environments like deep-sea and spac... -
Investors Eye Teledyne Technologies’ AI-Driven Software, Radiation-Hardened Space Chips, and MEMS Expansion Strategies
Simply Wall St USA Overview Teledyne Technologies' announcement of expanded AI-driven Prism Ground ISR software, radiation-hardened space-grade semiconductors, and MEMS manufacturing capabilities has captured investor attention. The succ... -
Teledyne Digital Imaging US Unveils High-Resolution Space Camera with Emerald 67M CMOS Sensor via SDL Licensing Agreement
01net USA Overview Teledyne Digital Imaging US has introduced a high-resolution, space-qualified camera under an intellectual property licensing agreement with Space Dynamics Laboratory (SDL). This new camera integrates Teledyne's Emeral... -
KIST Develops Ultra-Thin, Flexible 3D-Printable Composite for Simultaneous Electromagnetic and Neutron Radiation Shielding
AllMind AI News South Korea Overview The Korea Institute of Science and Technology (KIST) has unveiled an ultra-thin, flexible, and 3D-printable composite material capable of simultaneously shielding both electromagnetic waves and neutro... -
BAE Systems’ Endura Radiation-Hardened Microchip Passes Rigorous Testing for Classified and Missile-Defense Satellites
KeepTrack Space Brief USA Overview BAE Systems' Endura computing chip has successfully passed rigorous radiation testing for classified satellite and missile-defense applications. This radiation-hardened processor significantly enhances ... -
NASA Awards $13M Subcontract to Firefly Aerospace for 2028 Mars Helicopter Heat Shield Manufacturing
Gagadget.com USA Overview NASA's Jet Propulsion Laboratory (JPL) has signed a $13 million subcontract with Firefly Aerospace to build the aeroshell (heat shield and backshell) for the 2028 SkyFall Mars helicopter mission. This aeroshell ... -
STMicroelectronics Unveils LEOAC00PT-D, a Radiation-Hardened Logic Chip for LEO Satellites with 50 krad(Si) TID and SEL-Free Performance
Shenzhen Mingjiada Electronic Co., LTD. Switzerland Overview STMicroelectronics has introduced 'LEOAC00PT-D,' a radiation-hardened logic chip designed for Low Earth Orbit (LEO) space applications. This 4-channel, 2-input NAND gate chip w... -
Advanced Polyimide Materials like Imiditex and Tormed Unlock New Space System Applications with Lightweight, Radiation, and UV Resistance
AllMind AI News Global Overview Advanced polyimide materials are being developed for new applications in space systems, with products like Imiditex offering lightweight, radiation, and UV resistance. Tormed provides highly transparent fi... -
BAE Systems Secures $16M DPA Funding to Expand Radiation-Hardened Microelectronics Production in the US
ExecutiveGov USA Overview BAE Systems has been awarded $16 million from the U.S. Defense Production Act (DPA) Title III fund to significantly expand its domestic production of radiation-hardened microelectronics (RHM). This critical inve... -
Google Research Validates COTS Chips for LEO AI, Bolstering SpaceX’s Commercial Hardware Strategy
36Kr China Overview Google Research has demonstrated that commercial off-the-shelf (COTS) HBM memory and core computing chips can achieve sufficient radiation tolerance for extreme Low Earth Orbit (LEO) conditions. Rigorous 67MeV proton ...
