Ajinomoto– tag –
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Panel Warpage Control Emerges as Key Bottleneck Hindering FOPLP Cost Advantage in Advanced Packaging
EAA Partners - Substack USA Overview Panel warpage control is identified as a critical bottleneck preventing Fan-Out Panel Level Packaging (FOPLP) from realizing its theoretical cost advantages in advanced semiconductor manufacturing. Th... -
AI Infrastructure Component Crunch Becomes Reality: ABF Substrate Lead Times Hit 56 Weeks, Equipment Parts Up to 40 Months
BigGo Finance Taiwan Overview The supply shortage for AI infrastructure components is becoming entrenched; TrendForce reports ABF substrate lead times surged to 48–56 weeks, approximately 4 to 4.7 times the equilibrium. HDDs reached 50 w... -
AI Accelerator ABF Substrate Shortage to Exceed 40% by 2028; Ibiden, Unimicron, Samsung Electro-Mechanics Rush Billions in Capacity Expansion
Tom's Hardware Japan Overview The supply shortage of ABF (Ajinomoto Build-up Film) substrates for AI accelerators is projected to worsen significantly, potentially reaching approximately 10% by late 2026, 21% by 2027, and over 40% by 202... -
High-End ABF Substrate Supply Faces Critical Shortage Amid Gigantic AI Chip Growth, Fueling Intense Competition Among Taiwanese Manufacturers
Tom's Hardware Taiwan Overview The escalating computational power and physical size of AI chips have led to a severe global shortage in the supply of high-end Ajinomoto Build-up Film (ABF) substrates, a core component. In response, inten... -
TSMC’s CoWoS Drives AI Semiconductor Demand, Japanese Material Suppliers Expand Ecosystem in Taiwan
The Economy Taiwan Overview TSMC's CoWoS advanced packaging technology is a primary driver for demand in AI accelerators and HBM, leading Japanese material suppliers like Namics (underfill) and Fujifilm (CMP slurry) to expand operations ... -
Unimicron Reports 90% Surge in Equipment Demand from AI, Japanese SME Dependence on ABF Substrates Creates Bottleneck
BigGo Finance Taiwan Overview Unimicron Technology Chairman Chien Shan-Chieh stated that escalating AI demand has severely impacted the substrate sector, worsening supply-demand imbalance due to heavy reliance on small and medium-sized J... -
Dell Reports Record Q2 Revenue of $47 Billion with $95 Billion AI Server Backlog; Entire Supply Chain, Including DRAM, HBM, ABF Substrates, at ‘Redline’
KuCoin International Overview Dell reported record Q2 revenue of $47 billion and an impressive $95 billion backlog for AI servers. However, Dell executives stated that the entire supply chain, including DRAM, NAND, specific CPUs, mature ... -
TSMC SVP Reports 90% Surge in Equipment Orders in Six Months Driven by AI Demand: Equivalent to Building 20 Fabs Globally Simultaneously
TechSoda Taiwan Overview TSMC Senior VP Cliff Hou reported an astonishing 90% surge in equipment orders over six months, driven by AI demand far exceeding forecasts, equivalent to constructing nearly 20 fabs worldwide simultaneously. Uni... -
High-End ABF Substrate Shortage Intensifies Due to Massive AI Chips: Taiwanese Makers & Equipment Suppliers Face Fierce Competition
Medium (by Julien Nauy) International Overview The high-end ABF (Ajinomoto Build-up Film) substrate market for AI chips faces a severe supply shortage, reflecting a 're-evaluation of manufacturing difficulty' distinct from traditional AB... -
Ajinomoto Fine-Techno to Expand ABF Film Production Capacity, Anticipates Easing AI Chip Supply Shortages by Early 2027
The Wall Street Journal Japan Overview Ajinomoto Fine-Techno disclosed plans to significantly boost its production capacity for Ajinomoto Build-up Film (ABF) film across multiple manufacturing sites, driven by exploding demand for AI chi...
