Ajinomoto– tag –
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SiC Power Modules Get a Boost: Advanced Packaging with AMB and Embedded Die Transforms EV and AI Data Centers
[Industry Publication/Research] Global Overview Advanced packaging technologies for Silicon Carbide (SiC) power modules are dramatically improving thermal management and power density in electric vehicle (EV) inverters and AI data center... -
AI Chip HBM Integration to Drive 29% ABF Substrate Shortage by 2028; $19.1B Expansion Unlikely to Offer Short-Term Relief
Unknown Taiwan Overview The rapid integration of High Bandwidth Memory (HBM) into AI chips is set to drive a 39% Compound Annual Growth Rate (CAGR) in ABF substrate demand between 2025 and 2028. This surge is projected to create a supply... -
Advanced Package Substrate Market Heats Up: Ibiden Leads with $3.2 Billion Investment, Samsung Electro-Mechanics Challenges with Glass Substrates, Technical Hurdles Emerge
MK Japan Overview The package substrate market, crucial for AI semiconductor performance, is intensifying with major investments and technological competition. Japan's Ibiden maintains dominant leadership with ~35% market share, investin... -
Yole Group Forecasts Advanced Packaging Market to Double to Over $120 Billion by 2031, Driven by AI and HPC Demand
Yole Group (via advancedpackaging.news) France Overview Yole Group's latest report projects the global advanced packaging market to more than double from $55 billion in 2025 to over $120 billion by 2031, fueled by next-generation AI and ... -
AT&S to Invest €1.5-2 Billion in Malaysian ABF Capacity, While IBIDEN Allocates ¥500 Billion for AI/HPC Substrate Expansion in Japan & Overseas
Sector Signals China Overview AT&S has agreed with AMD and another major tech firm to expand high-end IC substrate capacity for AI/HPC, planning a €1.5-2 billion investment in its Kulim, Malaysia plant, fully supported by long-term c... -
AI-Driven Advanced Packaging Orders Surge, Widening ABF Carrier Board Supply-Demand Gap, Benefiting Industry with Both Volume and Price Increases
AlphaWire International Overview Nomura Securities reports the semiconductor packaging substrate industry is experiencing a strong AI-driven recovery, with global packaging substrate shipments up 36% year-on-year in June 2026. This growt... -
Wah Lee and Asahi Kasei Double Photoresist Capacity in Tainan to Capitalize on AI Advanced Packaging Boom and ABF Substrate Demand
BigGo Finance International Overview Wah Lee and Asahi Kasei are doubling high-resolution dry film photoresist capacity in Tainan to meet surging ABF substrate demand driven by AI, HPC, and advanced packaging. With the ABF substrate shor... -
ABF Substrates Emerge as the True Bottleneck in the AI Era, More Critical Than DRAM for High-Performance Computing
Industry Analysis International Overview ABF (Ajinomoto Build-up Film) substrates, not DRAM, are becoming the more critical bottleneck in the AI supply chain. Leading manufacturers like Ibiden and Unimicron are poised to benefit directly... -
Global ABF Substrate Shortage to Persist Through 2028 Due to Soaring AI Demand, Impacting High-End Chip Production
DigiTimes Taiwan Overview The global market for ABF (Ajinomoto Build-up Film) substrates is projected to remain in shortage through 2028, driven by escalating demand for AI hardware. This scarcity directly impacts the production of high-... -
Advanced Packaging Becomes the New Bottleneck for AI Chip Production, Driving Global Capex Race and Nvidia’s Supply Diversification Efforts
The Economy International Overview Advanced packaging, not process technology, is now the primary bottleneck in AI chip production, prompting Nvidia to explore diversifying its CoWoS supply, potentially including Intel's EMIB. This shift...
