Ajinomoto– tag –
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HBM and ABF Shortages Intensify AI Chip Supply Bottlenecks, Ajinomoto Forecasts Over 20% ABF Supply Gap by 2027
Semiconductor Engineering USA Overview The primary bottlenecks for AI chip production are the critical shortage of High-Bandwidth Memory (HBM) and the complex packaging capacity required for GPUs/XPUs by Nvidia, AMD, and Google, coupled ... -
Ajinomoto Fine-Techno Presents Advancements in ABF Film for AI Semiconductor Packaging, Supporting High-Performance Evolution
SEMI Global News Japan Overview Ajinomoto Fine-Techno has announced its latest advancements in ABF (Ajinomoto Build-up Film) technology for AI semiconductor packaging, contributing to higher performance and reliability in AI processors. ... -
TSMC Accelerates CoPoS Packaging with Glass Core Substrates: Targets 30% Cost Reduction, >90% Wafer Utilization Post-2028
Wccftech / CHOSUNBIZ / BigGo Finance Taiwan Overview TSMC is accelerating the development of CoPoS packaging, a successor to CoWoS, leveraging glass core substrates co-developed with Ibiden and Innolux. This panel-level packaging approac... -
Ajinomoto’s Critical Chip Film, ABF, Faces Supply Test as Escalating AI Demand Mounts Pressure for Price Hikes
digitimes Taiwan Overview Global AI chip demand is putting new pressure on the supply of Ajinomoto Build-up Film (ABF), a key material for advanced semiconductor packaging. Ajinomoto faces increasing pressure to raise ABF prices, making ... -
Ajinomoto’s ABF Price Stability Strategy Amid Surging AI Demand Prompts Investor Re-evaluation of Portfolio Focus
Simply Wall St News Japan Overview Despite record financial results and robust demand for AI-related Ajinomoto Build-up Film (ABF), Ajinomoto Corporation plans to maintain ABF prices and expand production capacity through 2032. This stra... -
Ajinomoto to Secure ABF Supply Capacity for AI Chip Demand Until 2030, Prioritizing Production Expansion Over Price Hikes
GIGAZINE Japan Overview Ajinomoto announced its capability to meet the surging demand for Ajinomoto Build-Up Film (ABF), a critical interlayer dielectric for advanced semiconductor packaging, until 2030, driven by the exponential growth ... -
AT&S Commits €2 Billion to Accelerate AI/HPC Chip Substrate Production in Asia, Bolstered by AMD Partnership
TNW オーストリア Overview Austrian IC substrate manufacturer AT&S is investing €1.5-2 billion to significantly expand high-end IC substrate capacity at its Kulim, Malaysia, and Chongqing, China, facilities. This strategic move, drive... -
ABF Substrates Become AI Accelerator Bottleneck, Nvidia’s H100 Requires 12+ Layers; Glass Substrates Emerge as Next-Gen Solution, Commercialization Years Away
Data Gravity USA Overview Ajinomoto Build-up Film (ABF) substrates are a critical component and growing bottleneck in AI accelerators, HBM, and chiplet-based designs. Nvidia's H100 GPU demands over 12 layers of ABF, with the Blackwell B2... -
Glass Substrates: The Next Frontier in AI Packaging and the Race to Mass Production
The Economy South Korea Overview Glass substrates are rapidly emerging as a transformative technology in advanced AI chip packaging, poised to replace conventional organic substrates and silicon interposers by offering superior dimension... -
Ibiden and Unimicron Unveil Over $5 Billion Investment to Dramatically Expand AI Server ABF Substrate Production
Next Financial Japan Overview Japanese Ibiden and Taiwanese Unimicron are jointly investing over ¥800 billion (approximately $5 billion USD) to significantly increase production capacity for high-performance ABF (Ajinomoto Build-up Film)...
