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CSIS Report: AI and HBM Demand Drive New Semiconductor Shortage, Highlighting Structural Shift and Supply Chain Security Concerns
CSIS USA Overview A CSIS report indicates that the current memory shortage reflects both structural demand growth from AI and cyclical market fluctuations. The rapid expansion of AI data centers has led to a surge in demand for HBM (High... -
HBM Identified as Primary Bottleneck for AI Chip Manufacturing; Nvidia, Google, AMD, Amazon Consumed 90% of Global Supply in 2025
New Market Pitch USA Overview High Bandwidth Memory (HBM) has emerged as the most significant bottleneck in AI chip manufacturing, surpassing advanced packaging technologies like CoWoS. According to Epoch AI estimates, just four companie... -
Samsung Dedicates Half of Its 4nm Foundry Capacity to HBM4 Base Dies Amid AI Boom
ZDNet Korea South Korea Overview Samsung Electronics is reportedly allocating over 50% of its advanced 4nm foundry capacity—specifically 15,000 wafers per month out of an estimated 30,000 total—to the production of HBM4 base dies. This s... -
2026 iPSC Industry Report: Allogeneic Therapies Surpass Autologous, Diabetes, Parkinson’s, AMD Clinical Trials Progress
BioInformant Global Overview The 2026 iPSC Industry Report by BioInformant details advancements in iPSC technology for therapeutic applications, disease modeling, drug discovery, personalized medicine, and toxicity testing. Notably, allo... -
Qualcomm Partners with Amazon to Expand AI Infrastructure Presence, Projecting $15 Billion Data Center Revenue by 2029 and Intensifying Competition with Nvidia
Facebook (Barrons) USA Overview Nvidia's stock slipped after Qualcomm announced an AI infrastructure deal with Amazon, highlighting intensifying competition in the AI semiconductor market. Qualcomm plans to manufacture multi-generational... -
AI Boom Spurs China’s Top OSATs to Pour Billions into Advanced Packaging
Digital Today China Overview China's three leading OSAT firms—JCET, Tongfu Microelectronics, and Huatian Technology—have reported significant profit surges in H1 2026, largely due to escalating AI semiconductor demand. In response, these... -
Taiwan’s OSATs Boost AI Capacity with $14.4B Capex; ASE Deepens TSMC CoWoS Collaboration to Meet Soaring Demand
Domino Theory Taiwan Overview Five leading Taiwanese chip packaging and test companies plan a record $14.4 billion (NT$460 billion) in capital expenditures this year to meet surging AI chip demand, matching TSMC's own advanced packaging ... -
TSMC CoWoS Capacity Expands 9X in 3 Years, Yet 10% AI Chip Shortage Persists with NVIDIA Securing 60%
XenoSpectrum Taiwan Overview TSMC's CoWoS advanced packaging capacity has surged nine-fold over three years, but a 10% supply shortage for AI chips remains due to soaring demand. NVIDIA currently secures approximately 60% of TSMC's CoWoS... -
Ocugen Doses First Patient in Phase 3 Registrational Trial for OCU410 Modifier Gene Therapy for Geographic Atrophy, Following RMAT Designation
GlobeNewswire USA Overview Ocugen has initiated patient dosing in its Phase 3 registrational trial for OCU410, a modifier gene therapy targeting geographic atrophy (GA) secondary to dry age-related macular degeneration (AMD). OCU410 rece... -
Ajinomoto Fine-Techno to Expand ABF Film Production Capacity, Anticipates Easing AI Chip Supply Shortages by Early 2027
The Wall Street Journal Japan Overview Ajinomoto Fine-Techno disclosed plans to significantly boost its production capacity for Ajinomoto Build-up Film (ABF) film across multiple manufacturing sites, driven by exploding demand for AI chi...
