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AI Data Centers Rapidly Transition to Photonic Interconnects Beyond Copper Limits, Driven by 800G/1.6T Devices and OCI MSA Standardization
Tom's Hardware USA Overview AI data centers are rapidly migrating to photonic interconnects due to copper's physical limitations, with accelerating shipments of 800G pluggable devices and the introduction of 1.6T modules. The Optical Com... -
AI Data Centers Accelerate Shift to 800G/1.6T Optical Interconnects; OCI MSA Defines Common Optical Physical Layer
MLQ News USA Overview AI data centers are rapidly transitioning from copper to optical interconnects due to copper's speed limitations, with accelerated adoption of 800G pluggable transceivers and the introduction of 1.6T products. The O... -
ClinicalTrials.gov Updates Phase 2 Trial Registration for iPSC-Derived Retinal Pigment Epithelium Cell Transplantation for Age-Related Macular Degeneration
ClinicalTrials.gov USA Overview Information regarding a Phase 2 clinical trial for iPSC-derived Retinal Pigment Epithelium (RPE) cell transplantation targeting Age-related Macular Degeneration (AMD) has been updated or newly registered o... -
Company Announces Positive Safety and Early Efficacy Signals in Phase 1 Clinical Trial of iPSC-Derived Retinal Cell Therapy, Aims for Phase 2 This Year
Endpoints News USA Overview A cell therapy development company has reported favorable safety data and initial efficacy signals from its ongoing Phase 1 clinical trial of an iPSC-derived cell therapy for a specific ocular disease. This th... -
Wooptix Unveils Astronomy-Inspired Tech to Resolve ‘Optical Bottleneck’ in AI Chip Packaging, Boosting Yield and Performance
EE Times USA Overview Wooptix has announced a groundbreaking new technology that applies adaptive optics, originally developed for astronomy, to resolve the 'optical bottleneck' in advanced AI chip packaging. This innovation dramatically... -
NVIDIA’s AI Financing Story Gains Momentum, Accelerating Funding Strategy and Investor Confidence
Kalkine Media USA Overview NVIDIA is accelerating its strategic financing activities to strengthen its leadership at the forefront of AI technology. Through continuous investment in GPU technology and the CUDA software platform, the comp... -
AI Chip Showdown: NVIDIA, AMD, and Intel Ignite New Battleground in 2026 with Blackwell Ultra and Instinct MI400
CryptoBriefing International Overview The AI chip race is set to intensify dramatically in 2026, as NVIDIA's 'Blackwell Ultra' and AMD's Instinct MI400 series usher in a fierce new phase of competition against Intel. These tech giants ar... -
Nvidia Dominates H1 2026 AI Chip Market with 75-81% Revenue Share, While AMD and Intel Gain Momentum with OpenAI Partnership and New GPU Sampling
The Motley Fool USA Overview Nvidia retained a dominant 75-81% revenue share in the AI accelerator market during the first half of 2026. However, AMD is strengthening its position through a strategic partnership with OpenAI, and Intel is... -
TSMC and Kinsus Jointly Developing New AI Chip Packaging Technology Akin to Intel’s EMIB to Address CoWoS Capacity Constraints
Tech in Asia Singapore Overview TSMC is reportedly collaborating with Kinsus to develop a novel AI chip packaging technology, resembling Intel's Embedded Multi-die Interconnect Bridge (EMIB), to alleviate the tight supply of CoWoS capaci... -
NVIDIA to Unleash ‘Rubin’ AI Platform in 2026, Integrating Next-Gen GPU, CPU, and Networking Technologies
The Daily Star Bangladesh Overview NVIDIA has announced the 2026 release of 'Rubin,' its next-generation AI chip platform, designed to dramatically elevate AI performance through tightly integrated, advanced GPUs, CPUs, and networking ch...
