AMD– tag –
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TSMC Unveils SoIC 3D Stacking Roadmap: Achieving 4.5µm Pitch by 2029, Enabling Face-to-Face Chiplet Integration for Fujitsu Monaka CPU
専門メディア Taiwan Overview TSMC has revealed its SoIC (System on Integrated Chips) 3D stacking roadmap, targeting a 4.5-micron pitch by 2029, down from today's 6 microns. This advanced face-to-face (F2F) chiplet stacking technology, pa... -
New Coalition Forms to Advance Optical Connectivity for AI Data Centers: Standardizing Expanded Beam Optical (EBO) Connectors
3M News USA Overview To support the rapid scale-up of AI data centers, industry leaders including 3M have formed a Multi-Source Agreement (MSA) to develop standard specifications for Expanded Beam Optical (EBO) connector solutions. EBO t... -
Broadcom Unveils VMware Cloud Foundation 9.1 to Enhance Cost-Efficiency and Security for Production AI in Private Clouds
Storage Newsletter USA Overview Broadcom has announced VMware Cloud Foundation (VCF) 9.1, a secure and cost-effective infrastructure platform engineered for production AI workloads. VCF 9.1 provides an AI and Kubernetes-native private cl... -
Zyphra Unveils ZAYA1-8B: Small AI Model Achieves Large-Scale Performance with 700M Active Parameters
ライブドアニュース (GIGAZINEからの転載) Japan Overview US AI startup Zyphra has released ZAYA1-8B, a compact inference language model trained on AMD GPU infrastructure. Despite being an 8-billion-parameter Mixture of Experts (MoE) model,... -
Global AI Chip Shortage: Supply Chain Bottlenecks and Surging Demand Challenge Industry Giants
Epoch AI USA Overview The demand for AI chips is critically high, with major AI companies requiring more chips than available, due to complex production and supply chain bottlenecks. NVIDIA remains dominant, but tech giants like Google a...
