AMD– tag –
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Advanced Packaging’s Evolution: 2.5D/3D Integration, Chiplets, and Hybrid Bonding Propel AI and HPC
Springer Professional Germany Overview Semiconductor packaging technology has dramatically evolved from 2D to 2.5D and 3D IC integration, a transformation accelerated by the explosive demand from AI and High-Performance Computing (HPC). ... -
TSMC to Boost CoWoS Capacity Tenfold to 130K Wafers/Month by Late 2026, Accelerates Glass-Substrate CoPoS for AI Chips
Tom's Hardware USA Overview TSMC is aggressively expanding its advanced packaging capacity, projecting a tenfold increase in CoWoS production to over 130,000 wafers per month by the end of 2026 to meet surging AI demand. Despite this, de... -
Oriole Networks, in Collaboration with AMD, Commercially Deploys First Photonic AI Network in UK, Slashing Power Consumption by 81%
SiliconANGLE Media Inc. USA Overview Oriole Networks has achieved the world's first large-scale commercial deployment of an AI system operating entirely on a photonic network, in collaboration with AMD. This system, deployed at the UK's ... -
NVIDIA Achieves $81.6 Billion Revenue in FY27 Q1, Accelerating 85% YoY Growth, Expands Beyond GPU Market into Server Processors
The Motley Fool USA Overview NVIDIA reported achieving $81.6 billion in revenue for Q1 FY27, marking an accelerated year-over-year growth of 85%. The company forecasts a further 95% increase to $91 billion for the current quarter, benefi... -
AI Startup Funding Surges: TensorWave Secures $350M, Cyera $600M, Recursive $650M, Powering Infrastructure and Security Sectors
Scouts by Yutori USA Overview Over the past seven days, multiple large funding rounds for AI startups have been announced, indicating robust investor demand in AI infrastructure and security. TensorWave secured $350 million for AMD-based... -
AMD Announces Over $10 Billion Taiwan Ecosystem Investment to Bolster AI Infrastructure and Advanced Packaging Manufacturing
Electronics Engineering Herald - EEHerald USA Overview AMD announced an investment exceeding $10 billion in Taiwan's ecosystem to expand its AI infrastructure and advanced packaging manufacturing capabilities. This significant capital in... -
TSMC CoWoS Capacity Becomes Major AI Chip Growth Bottleneck: Ramping to 120K Wafers/Month by late 2026 Still Falls Short of Demand
backplane Taiwan Overview TSMC's CoWoS packaging capacity is identified as the most critical bottleneck hindering AI chip evolution. While TSMC plans to quadruple its CoWoS production capacity from approximately 35,000 wafers/month in la... -
AMD Explores Powertech’s FOPLP for Next-Generation Zen 7 CPUs, Eyeing Packaging Diversification
TechPowerUp USA Overview AMD is reportedly exploring Powertech Technology's Fan-Out Panel-Level Packaging (FOPLP) for its upcoming "Zen 7" CPUs, codenamed "Grimlock." This move signals AMD's strategic intent to build increasingly complex... -
AMD Commits Over $10 Billion to Taiwan’s AI Ecosystem for Advanced Packaging and EFB Technology Expansion
EE Times Taiwan Overview AMD announced an investment exceeding $10 billion into Taiwan's AI ecosystem, bolstering advanced packaging capabilities and R&D. This initiative specifically targets Elevated Fanout Bridge (EFB) based 2.5D p... -
SK Hynix Initiates HBM Packaging Hub Construction in Cheongju to Bolster AI Memory Capacity
専門メディア South Korea Overview SK Hynix has broken ground on a substantial advanced packaging facility in Cheongju Technopolis, signaling a strategic shift in AI semiconductor competition from wafer fabrication to performance-critical...
