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Catalent and Nanoscope Expand Supply Partnership for Commercialization of Optogenetic Gene Therapy MCO-010 for Retinal Degenerative Diseases
LucidQuest Ventures USA Overview Catalent and Nanoscope Therapeutics have expanded their partnership to support the late-stage development and commercial supply of MCO-010, an optogenetic gene therapy candidate for retinal degenerative d... -
NVIDIA Unveils “RTX Spark” AI Chip for PCs, Intel Boosts Industrial Edge AI with Core Ultra Series 3, AMD Eyes NPU-Powered Ryzen for Market Dominance
AI Chips News USA Overview NVIDIA announced its "RTX Spark" AI chip for personal computers on July 4, 2026, set to debut this fall in new Windows PCs from major manufacturers like Lenovo and Microsoft Surface. Concurrently, Intel is enha... -
Nomura Raises TSMC Target Price, Citing AI Infrastructure Cycle as Key Growth Driver
Futu News Taiwan Overview Nomura has upgraded TSMC's target price, attributing its strong growth to the accelerating AI infrastructure cycle. The surging demand for AI chips has led to TSMC's advanced packaging technologies, particularly... -
SK Hynix Announces Massive $64 Billion Investment in South Korea to Bolster AI Memory and Packaging Capabilities
Biggo Finance South Korea Overview SK Hynix has unveiled plans for a colossal $64 billion investment in memory chip and advanced packaging facilities within South Korea over the coming years. This strategic outlay aims to address the soa... -
eWeek Reports on Critical AI Chip Bottlenecks: Advanced Packaging Identified as Key Solution
eWeek USA Overview A new eWeek report highlights that AI chip performance is confronting significant bottlenecks, deeming advanced packaging technologies essential for resolution. Critically, the scarcity of high-density integration tech... -
ASE Elevates Advanced Packaging Quotes Over 20% Amid Explosive AI Demand Crunch
SiliconAnalysts Taiwan Overview ASE Technology, the world's largest outsourced semiconductor assembly and test (OSAT) provider, has increased its advanced packaging service prices by over 20%. This hike is a direct response to unpreceden... -
ASE to Commence FOPLP Mass Production by End-2026, Launching 15 Expansion Projects Amid AI Chip Boom
TrendForce Taiwan Overview ASE Technology, the world's largest semiconductor packaging and testing services provider, announced plans to begin mass production of Fan-out Panel-Level Packaging (FOPLP) by the end of 2026. This initiative, ... -
AMD MI500 Series Matches Nvidia B300 in MLPerf Inference Benchmarks, Signifying a Shift in the AI Chip Market Landscape
Apple Podcasts (Semiconductor News with Fexingo) USA Overview While Nvidia's stock dipped 7% last week, AMD remained stable, indicating a potential shift in the AI chip market. Recent MLPerf benchmarks demonstrate AMD's MI500 series deli... -
Imec’s Chiplet Imperative: Analyzing the Transition to High-Bandwidth, Low-Energy AI/HPC Systems
imec ベルギー Overview Imec has published a comprehensive analysis identifying the economic and technical inflection points for transitioning from monolithic ASICs to chiplet-based designs, particularly for AI, HPC, and data center appli... -
ASE Technology Holding Raises 2026 Capex to $8.5 Billion Driven by Surging AI Advanced Packaging Demand, Launches 15 Expansion Projects in Taiwan & Malaysia
SemiMedia Taiwan Overview ASE Technology Holding, the world's largest OSAT provider, has significantly increased its 2026 capital expenditure plan from $7 billion to $8.5 billion, a 21.4% jump, driven by robust demand from AI servers, HP...
