AMD– tag –
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TSMC Accelerates Advanced Packaging Strategy: Addressing CoWoS Capacity Shortfall, Driving AI Accelerator Demand
Umbrex Taiwan Overview TSMC's strategy is founded on advanced process technology, manufacturing yield, reliable execution, and a broad design ecosystem. As chip architectures shift towards chiplets and 3D integration, advanced packaging ... -
AMD’s Supercomputing Gains and Instinct GPUs Accelerate AI Data Center Growth with Meta’s 6-Gigawatt Deployment
Yahoo Finance USA Overview AMD's growth in supercomputing and the expansion of AI data centers with Instinct GPUs are fueling its next phase of AI-driven growth. AMD EPYC CPUs and Instinct GPUs power four of the world's top ten fastest s... -
Tesla Plans to Sell Modular AI Data Center Hardware ‘Megapod,’ Entering Nvidia-Dominated AI Market
Electrek USA Overview Tesla has revealed plans to sell modular AI data center hardware, dubbed 'Megapod,' through a new trademark application. Megapod is a self-contained computing system tailored for AI workloads, comprising computer se... -
2026 AI Chip Market Sees 44.6% Surge in Cloud Provider Custom ASIC Shipments, Challenging NVIDIA’s GPU Dominance
AIMultiple International Overview In the 2026 AI chip market, while NVIDIA's GPUs remain central, custom ASIC shipments from cloud providers are surging 44.6% year-over-year, reshaping the market structure. AIMultiple's analysis shows AS... -
AT&S Commits €2 Billion to Accelerate AI/HPC Chip Substrate Production in Asia, Bolstered by AMD Partnership
TNW オーストリア Overview Austrian IC substrate manufacturer AT&S is investing €1.5-2 billion to significantly expand high-end IC substrate capacity at its Kulim, Malaysia, and Chongqing, China, facilities. This strategic move, drive... -
AT&S Commits €2 Billion to Malaysian Expansion, Supercharging AI IC Substrate Capacity for AMD and Key Tech Partners
EQS News オーストリア Overview Austrian IC substrate manufacturer AT&S is undertaking a significant €1.5-2 billion expansion of its Kulim, Malaysia plant to dramatically increase high-end IC substrate production for AI and high-perfo... -
AT&S Unveils €2 Billion Kulim Expansion to Fuel AI Boom with Advanced IC Substrates and PCBs
AT&S Official Press Release オーストリア Overview AT&S is undertaking a monumental €1.5 billion to €2 billion expansion of its Kulim, Malaysia, manufacturing facility. Driven by long-term commitments from industry leaders like AMD, t... -
NVIDIA’s Full-Stack AI Infrastructure, from Silicon to Cloud, With CUDA as Its Primary Moat, Explained by Data Science Collective
Data Science Collective - Medium USA Overview NVIDIA is presented as a full-stack AI infrastructure company, encompassing five layers: silicon, networking, platform software (CUDA), framework integration, and cloud services. The article ... -
NVIDIA Maintains 80% AI Chip Market Dominance via CUDA, But Google TPU, AMD, and Custom Silicon Intensify Competition
WEEX Crypto Wiki International Overview NVIDIA commands approximately 80% of the AI accelerator market, largely due to its CUDA software ecosystem, despite increasing competition. Google's TPU v5 chips are emerging as a cost-effective al... -
AMD Instinct MI350 Series GPUs Achieve 3.5x Generational Gain on Llama 2-70B and Competitive LLM Training Performance Against NVIDIA B200 in MLPerf Training 6.0
AMD USA Overview AMD has announced its MLPerf Training 6.0 results, showcasing a 3.5X generational performance gain on Llama 2-70B and competitive performance against NVIDIA B200 for LLM training workloads with its Instinct MI350 Series ...
