Amkor Technology– tag –
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AI Chip Packaging Bottleneck Intensifies: NVIDIA Explores Intel EMIB Amid TSMC CoWoS Shortage, Amkor Commits $7B to Arizona
The Economy Japan Overview The burgeoning AI chip market faces a critical bottleneck in advanced packaging, particularly with TSMC's CoWoS technology, prompting NVIDIA to reportedly consider Intel's EMIB for future GPU production. This s... -
Micron Invests $500M in GlobalWafers Texas Plant, Targets 40% US DRAM Production by 2035
Tom's Hardware USA Overview Micron Technology has committed $500 million to GlobalWafers' Texas wafer plant, aligning with its ambitious goal to manufacture 40% of its DRAM in the United States by 2035, part of a broader $250 billion US ... -
TSMC’s CoWoS Supply to Reach At Least 200K Wafers Monthly by 2027, Accelerating Expansion to Meet Soaring AI Demand
DigiTimes Taiwan Overview TSMC is accelerating its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity expansion to meet robust AI chip demand, with market indications suggesting monthly output will reach at least 200,000 wafe... -
Amkor Technology Expands Arizona Campus with 67-Acre Acquisition, Bolstering U.S. Advanced Packaging OSAT Capacity
AllMind AI News USA Overview Amkor Technology has acquired an additional 67 acres in Arizona to significantly expand its U.S. advanced semiconductor packaging and test capacity. This expansion, supported by up to $407 million in CHIPS Ac... -
Advanced Packaging Becomes the New Bottleneck for AI Chip Production, Driving Global Capex Race and Nvidia’s Supply Diversification Efforts
The Economy International Overview Advanced packaging, not process technology, is now the primary bottleneck in AI chip production, prompting Nvidia to explore diversifying its CoWoS supply, potentially including Intel's EMIB. This shift... -
Morgan Stanley Forecasts 93% Surge in CoWoS Demand by 2027, Anticipates AMD Venice CPU Adoption
Phemex News USA Overview Morgan Stanley projects a staggering 93% surge in global demand for CoWoS (Chip-on-Wafer-on-Substrate) technology by 2027, reaching 2.694 million units. Nvidia is expected to remain the largest consumer, accounti... -
Amkor Technology Commits $2.5B-$3.0B to Advanced Packaging Facilities for AI Demand, Arizona Plant Slated for 2028 Production
Hudson Labs USA Overview Amkor Technology plans a substantial capital expenditure of $2.5 billion to $3.0 billion for fiscal year 2026, driven by accelerating demand for advanced packaging in AI and data center computing. The investment ... -
OSAT Vendors Report Strong Q1 2026 Revenue Growth Driven by AI-Related Advanced Packaging Demand: ASE Up 18%, Amkor Up 25%
Counterpoint Research Global Overview The Outsourced Semiconductor Assembly and Test (OSAT) sector recorded robust revenue growth in Q1 2026, fueled by surging AI-driven advanced packaging demand. ASE Technology Holding reported an 18% y... -
TSMC and Amkor Technology Forge 10-Year Strategic Partnership to Expand Advanced Chip Packaging Capabilities in the US
Focus Taiwan USA Overview TSMC and Amkor Technology have entered a 10-year strategic agreement to significantly bolster advanced semiconductor packaging and test capacity in the United States. This partnership aims to expand advanced pac... -
Morgan Stanley Raises CoWoS Demand Forecast to 2.69 Million Wafers by 2027, Citing CPUs and ASICs as New Drivers
Industry Analysis / Moomoo Unknown Overview Morgan Stanley has significantly raised its demand forecast for TSMC's CoWoS packaging, projecting it to reach 2.69 million wafers annually by 2027. CPUs and ASICs are emerging as new key drive...
