Base Die– tag –
-
Samsung Dedicates Half of Its 4nm Foundry Capacity to HBM4 Base Dies Amid AI Boom
ZDNet Korea South Korea Overview Samsung Electronics is reportedly allocating over 50% of its advanced 4nm foundry capacity—specifically 15,000 wafers per month out of an estimated 30,000 total—to the production of HBM4 base dies. This s... -
HBM4 Breaks Bottlenecks: Hybrid Bonding Delivers 20%+ Thermal Reduction, 40% Power Efficiency Boost, 2.0TB/s+ Bandwidth
SemiHub.io International Overview HBM4, the next-generation High Bandwidth Memory, is set to significantly advance AI/HPC performance by doubling its I/O width to 2048 bits, targeting over 2.0 TB/s bandwidth per stack and substantial pow... -
SK hynix’s Early Strategic Investment in AI and HBM Drives Market Value Lead Over Samsung, Bolstering Production Capacity for NVIDIA Demand
Reuters South Korea Overview SK hynix's early and aggressive investment in HBM (High Bandwidth Memory) technology and significant capacity expansion, anticipating future NVIDIA demand, has allowed it to differentiate from Samsung Electro... -
Samsung and SK Hynix Announce Major HBM Capacity Expansions: Samsung Allocates Half to HBM4, Targeting 250K Wafers/Month by EOY 2026
Industry News / ChosunBiz South Korea Overview Samsung Electronics announced plans to increase its HBM production capacity by approximately 50% from 2025 levels, aiming for 250,000 semiconductor wafers per month by the end of 2026. The c... -
Samsung Reportedly to Launch Physical AI Chiplet Platform Next Year, Accelerating AI Inference and Infrastructure
Design And Reuse South Korea Overview Samsung is reportedly planning to launch a physical AI chiplet platform as early as next year, aiming to accelerate next-generation chip development for AI inference and infrastructure. This platform... -
SK Group Chairman Deepens AI Alliances with Nvidia and TSMC, Expanding Next-Gen HBM and Advanced Packaging Collaboration
The Korea Herald South Korea Overview SK Group Chairman Chey Tae-won has strengthened alliances with leading AI chipmakers, meeting with Nvidia CEO Jensen Huang and later with TSMC Chairman C.C. Wei in Taiwan. Discussions focused on expa... -
Samsung Electronics Begins Shipment of Industry’s First 12-Layer HBM4E Samples, Improving Energy Efficiency by 16% and Thermal Resistance by 14% Over HBM4
Samsung Electronics South Korea Overview Samsung Electronics has commenced shipments of industry-first 12-layer HBM4E samples to key global customers. This HBM4E improves energy efficiency by 16% and thermal resistance by over 14% compar...
1